Reflective photomask substrate, reflective photomask, and manufacturing method of reflective photomask

TW202638162APending Publication Date: 2026-09-16AGC INC
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Patent Information

Application Number
TW114144279
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-13
Filing Date
2025-11-13
Publication Date
2026-09-16

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Abstract

This invention provides a reflective photomask substrate that, after etching the absorber film, is less prone to the formation of a deteriorated layer on the exposed side of the absorber film, has a higher etching rate for the buffer layer, and exhibits lower crystallinity. The reflective photomask substrate of this invention sequentially comprises a substrate, a multilayer reflective film for reflecting EUV light, a buffer layer, and an absorber film. The absorber film contains platinum, and the buffer layer contains nitrogen, with the nitrogen content being less than 20 atomic percent relative to the total atoms of the buffer layer.
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