Temperature control method for substrate processing apparatus and substrate processing apparatus

Abstract

Friction between the processing container and the contact member adjacent to and in contact with the processing container is suppressed. In a substrate processing apparatus having a processing container and a contact member in contact with the processing container, the heat capacity of the contact member is less than the heat capacity of the processing container; the control unit sets a first set temperature for the temperature of the processing container and a second set temperature for the temperature of the contact member; the temperature control machine starts changing the temperature of the processing container toward the first set temperature and starts changing the temperature of the contact member toward the second set temperature; when the temperature control machine performs temperature change processing, the first set temperature is set to the required temperature of the processing container, and the second set temperature is set to a temperature different from the required temperature of the contact member; then, when the difference between the measured temperature of the processing container and the second set temperature is consistent with a preset stage control temperature difference, the stage control temperature difference is used to update the second set temperature.

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