Heat dissipation plate, heat dissipation device and computing device

Abstract

A heat dissipation plate includes a frame, a cold plate and a vapor chamber. The frame is provided with a first accommodation chamber and a second accommodation chamber in space connection with each other. An end surface of the frame is provided with a first opening in space connection with the second accommodation chamber. The cold plate is mounted in the first accommodation chamber. The cold plate includes a first housing provided with a liquid cooling chamber in which a liquid coolant is provided. The first housing is provided with a liquid inlet and a liquid outlet that are in space connection with the liquid cooling chamber. The liquid inlet is configured to input the liquid coolant into the liquid cooling chamber. The liquid outlet is configured to output the liquid coolant from the liquid cooling chamber. The vapor chamber is mounted in the second accommodation chamber. The vapor chamber has one end disposed corresponding to the first opening and another end connected to the cold plate. The vapor chamber is provided with a phase-change medium therein.

Description

[Technical Field]

[0001] This application relates to the field of computer accessories technology, and in particular to a heat sink, heat dissipation device and computing device. [Previous Technology]

[0002] With the acceleration of global digitalization and the explosive growth of computing power demand, server chips are becoming increasingly powerful and have higher and higher requirements for heat dissipation during iterative upgrades.

[0003] To meet the increasingly demanding heat dissipation requirements of server chips, the heat dissipation capacity of heat dissipation devices needs to be continuously improved. Current heat dissipation devices are cold plate heat sinks, which rely on liquid cooling media flowing inside the cold plate to remove surface heat from the chip. However, the convective heat transfer capacity of this single-phase liquid is limited, making it difficult to meet the heat dissipation requirements of high-power chips. Therefore, current heat dissipation devices suffer from low heat exchange efficiency and poor heat dissipation capacity. [Summary of the Invention]

[0004] Based on this, it is necessary to provide a heat sink, a heat sink device, and a computing device to address the problems of low heat exchange efficiency and poor heat dissipation capacity of heat dissipation devices.

[0005] This invention provides a heat sink, comprising:

[0006] A frame, the frame having a first accommodating cavity and a second accommodating cavity, the first accommodating cavity and the second accommodating cavity being connected, the end face of the frame having a first opening, the first opening being connected to the second accommodating cavity;

[0007] Cold plate, the cold plate is installed in the first accommodating cavity, the cold plate includes a first housing, the first housing is provided with a liquid cooling cavity, the liquid cooling cavity is provided with a liquid cooling medium, the first housing is provided with a liquid inlet and a liquid outlet, the liquid inlet and the liquid outlet are both connected to the liquid cooling cavity;

[0008] and a heat spreader plate, wherein the heat spreader plate is installed in the second accommodating cavity, one end of the heat spreader plate is correspondingly disposed to the first opening, the other end of the heat spreader plate is connected to the cold plate, and a phase change medium is disposed inside the heat spreader plate.

[0009] In one embodiment, the heat spreader includes a second shell, a capillary wick, and a support member. The second shell has an evaporation end face and a condensation end face. The evaporation end face is disposed facing the first opening. The condensation end face is connected to the cold plate. The second shell has a vacuum chamber. The capillary wick covers the inner wall of the vacuum chamber. The support member includes multiple members. One end of the support member is connected to the evaporation end face, and the other end of the support member is connected to the condensation end face. The phase change medium is disposed in the vacuum chamber.

[0010] In one embodiment, one end of the support member is obliquely arranged to the evaporation end face, and the other end of the support member is obliquely arranged to the condensation end face, and multiple support members are connected end to end in the vacuum cavity to form a zigzag structure; or,

[0011] One end of the support is perpendicularly connected to the evaporation end face, and the other end of the support is perpendicularly connected to the condensation end face.

[0012] In one embodiment, the cold plate further includes a plurality of fins, the plurality of fins being spaced apart in the liquid cooling cavity, and the plurality of fins being connected to the end face of the first housing near the heat spreader.

[0013] In one embodiment, the capillary core is a wire mesh capillary core, a sintered capillary core, or a grooved capillary core.

[0014] In one embodiment, the phase change medium is high-purity water or ethanol.

[0015] In one embodiment, the frame is further provided with a second opening, the second opening is disposed on the side opposite to the first opening, the end face of the cold plate away from the heat spreader faces the second opening, and the liquid inlet and the liquid outlet are both disposed on the end face of the cold plate away from the heat spreader.

[0016] In one embodiment, the heat sink further includes a fastener disposed on the frame, the fastener being used to connect the frame to the device to be cooled.

[0017] The present invention also provides a heat dissipation device, including a water pump, a first pipe, a second pipe, a water tank, and a heat dissipation plate as described in any of the above embodiments. The output end of the water tank and the liquid inlet of the heat dissipation plate are connected through the first pipe, and the liquid outlet of the heat dissipation plate and the input end of the water tank are connected through the second pipe. The water tank, the heat dissipation plate, the first pipe, and the second pipe are sequentially connected to form a circulation pipe, and the water pump is disposed in the circulation pipe.

[0018] The present invention also provides a computing device, including a computing element and a heat sink as described in any of the above embodiments, wherein the heat sink is mounted on the computing element.

[0019] The aforementioned heat sink, by installing a cold plate in the first accommodating cavity of the frame and a heat spreader in the second accommodating cavity of the frame, connects the cold plate and the heat spreader. The side of the heat spreader facing the first opening is used to install on the component requiring heat dissipation. The heat from the component is transferred to the heat spreader, causing the phase change medium to absorb heat and evaporate from liquid to gas. The cold plate inputs liquid cooling medium into the liquid cooling cavity of the first shell through the liquid inlet. The heat spreader transfers heat to the cold plate on the side close to the cold plate, causing the evaporated gas to condense into liquid. The alternating process of evaporation and condensation inside the heat spreader removes a large amount of heat. Therefore, phase change heat transfer relying on liquid evaporation and gas condensation can transfer more heat in a short time than heat transfer relying solely on convection of the cold plate, significantly enhancing the heat dissipation capacity of the heat sink and thus reducing the temperature of the component. It has the advantages of high heat exchange efficiency and strong heat dissipation capacity.

[0020] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention.

Implementation Method

[0021] To make the above-mentioned objects, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0022] In the description of this application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or positional relationship indicated by these terms is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0023] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0024] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," "fixing," etc., shall be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral part; they may refer to a mechanical connection or an electrical connection; they may refer to a direct connection or an indirect connection through an intermediate medium; they may refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0025] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact, or that they are in indirect contact through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0026] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element present. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0027] Referring to Figure 1, a schematic diagram of the structure of a heat sink in an embodiment of the present application is shown. The heat sink includes a frame 100, a cold plate 200 and a heat spreader 300. The frame 100 is provided with a first accommodating cavity 100A and a second accommodating cavity 100B, which are connected. The end face of the frame 100 is provided with a first opening 100C, which is connected to the second accommodating cavity 100B. A cold plate 200 is installed in the first accommodating cavity 100A. The cold plate 200 includes a first housing 210, which has a liquid cooling cavity 210A containing a liquid cooling medium. The first housing 210 has a liquid inlet 210B and a liquid outlet 210C, both of which are connected to the liquid cooling cavity 210A. The liquid inlet 210B is used to input the liquid cooling medium into the liquid cooling cavity 210A, and the liquid outlet 210C is used to output the liquid cooling medium from the liquid cooling cavity 210A. A heat spreader 300 is installed in the second accommodating cavity 100B. One end of the heat spreader 300 corresponds to the first opening 100C, and the other end of the heat spreader 300 is connected to the cold plate 200. The heat spreader 300 contains a phase change medium.

[0028] In an optional embodiment, the frame 100 is a cuboid structure, and the cold plate 200 and the heat spreader 300 are stacked inside the frame 100.

[0029] In an optional embodiment, as shown in FIG1, the first accommodating cavity 100A is located on the upper layer of the second accommodating cavity 100B, and the heating element to be installed is located on the lower layer of the second accommodating cavity 100B. That is, the first accommodating cavity 100A is disposed at the end of the second accommodating cavity 100B away from the heating element, and the cold plate 200 is connected to the end of the heat spreader 300 away from the heating element.

[0030] The heat dissipation plate described in this application embodiment involves installing a cold plate 200 in the first accommodating cavity 100A of the frame 100 and a heat spreader 300 in the second accommodating cavity 100B of the frame 100. The cold plate 200 and the heat spreader 300 are connected. The side of the heat spreader 300 facing the first opening 100C is used to install on the component that needs heat dissipation. The heat from the component is transferred to the heat spreader 300, causing the phase change medium to absorb heat and evaporate from liquid to gas. The cold plate 200 inputs liquid cooling medium into the liquid cooling cavity 210A of the first housing 210 through the liquid inlet 210B. The heat spreader 300 transfers heat to the cold plate 200 on the side close to the cold plate 200, causing the evaporated gas to condense into liquid. The alternating process of evaporation and condensation inside the heat spreader 300 carries away a large amount of heat.

[0031] The heat sink described in this application embodiment, by setting a phase change medium in the heat spreader 300, relies on the phase change heat transfer of the liquid evaporation and gas condensation of the phase change medium to transfer the heat on the component that needs to be cooled to the cold plate 200 and be carried away by the liquid cooling medium. Compared with the heat transfer of the cold plate 200 alone, it can transfer more heat in a short time, which can significantly enhance the heat dissipation capacity of the heat sink, thereby reducing the temperature of the component. It has the advantages of high heat exchange efficiency and strong heat dissipation capacity.

[0032] In some embodiments, as shown in FIG1, the heat spreader 300 includes a second housing 310, a capillary wick 320, and a support member 330. The second housing 310 is provided with an evaporation end face 311 and a condensation end face 312. The evaporation end face 311 is disposed facing the first opening 100C, and the condensation end face 312 is connected to the cold plate 200. The second housing 310 is provided with a vacuum chamber 310A. The capillary wick 320 covers the inner wall of the vacuum chamber 310A. The support member 330 includes multiple members. One end of the support member 330 is connected to the evaporation end face 311, and the other end of the support member 330 is connected to the condensation end face 312. The phase change medium is disposed in the vacuum chamber 310A. By providing a sealed vacuum chamber 310A in the second housing 310, the sealed vacuum chamber 310A can ensure that the phase change medium undergoes efficient phase change circulation in the second housing 310. A phase change medium is placed inside a vacuum chamber 310A. A capillary wick 320 is then placed over the inner wall of the vacuum chamber 310A, causing the liquid phase change medium condensed at the condensation end face 312 to flow back to the evaporation end face 311 under capillary force, forming a circulation and reflux of the phase change medium. Furthermore, a support member 330 is also provided inside the vacuum chamber 310A. The two ends of the support member 330 are connected to the evaporation end face 311 and the condensation end face 312, respectively, thereby providing support for the evaporation end face 311 and the condensation end face 312, preventing the heat spreader 300 from deforming under pressure, and maintaining the stability of the vacuum chamber 310A.

[0033] In an exemplary embodiment, the heat sink works by having its evaporation end face 311 contact the encapsulation surface of the component to be cooled through a thermally conductive contact material. The thermally conductive contact material can be thermal paste, thermal pad, thermal sealant, etc.

[0034] In an exemplary embodiment, the support 330 is a cylindrical structure, with the two ends of the cylinder connected to the evaporation end face 311 and the condensation end face 312, respectively.

[0035] In one exemplary embodiment, the second housing 310 is made of a high thermal conductivity metal, such as copper or a copper-aluminum alloy, to improve the thermal conductivity of the heat spreader 300, thereby improving the heat dissipation efficiency of the heat sink. In other embodiments, the second housing 310 may also be made of aluminum to suit certain lightweight applications.

[0036] In an exemplary embodiment, the material of the support member 330 is the same metal material as that of the second housing 310, so that the support member 330 provides a certain strength support for the heat spreader 300.

[0037] In an optional embodiment, as shown in FIG1, one end of the support member 330 is obliquely arranged to the evaporation end face 311, and the other end of the support member 330 is obliquely arranged to the condensation end face 312. Multiple support members 330 are sequentially connected end-to-end within the vacuum cavity 310A to form a zigzag structure. By setting the end faces of the support member 330 and the second housing 310 to an inclined state, and connecting multiple support members 330 to form a zigzag structure, the support structure of the support member 330 is made more stable, preventing deformation of the evaporation end face 311 and the condensation end face 312 of the second housing 310, which would result in insufficient connection between the second housing 310 and the first housing 210, thereby avoiding affecting heat conduction and improving the heat dissipation efficiency of the heat sink. Furthermore, the inclined state of the support member 330 can also be used to guide the phase change medium condensed into a liquid state, allowing the deformable medium to circulate.

[0038] In other embodiments, as shown in FIG2, one end of the support member 330 is perpendicularly connected to the evaporation end face 311, and the other end of the support member 330 is perpendicularly connected to the condensation end face 312. Setting the support member 330 to be perpendicularly connected to the evaporation end face 311 and the condensation end face 312 can also provide support for the second housing 310 and prevent the second housing 310 from deforming.

[0039] In an optional embodiment, as shown in FIG1, the cold plate 200 further includes a plurality of fins 220, which are spaced apart in the liquid cooling cavity 210A and connected to the end face of the first housing 210 near the heat spreader 300. By connecting the plurality of fins 220 to the end face of the first housing 210 near the heat spreader 300, the heat dissipation contact area of ​​the original end face is expanded to the fins 220, thereby increasing the heat dissipation surface area of ​​the cold plate 200, providing more heat exchange interfaces for heat transfer, and improving the heat dissipation effect of the heat sink.

[0040] In an optional embodiment, the capillary 320 is a wire mesh capillary, a sintered capillary, or a grooved capillary. The wire mesh capillary is composed of multiple layers of woven metal wires stacked together, exhibiting high permeability and low flow resistance to the gaseous phase change medium. The sintered capillary is a porous structure formed by high-temperature sintering of metal powder, possessing extremely strong capillary force, enabling rapid pumping of the phase change medium back to the evaporation end face 311. The grooved capillary is formed by mechanical or chemical etching into the inner wall of the second housing 310, opening diffusion channels for the gaseous phase change medium and achieving the highest permeability. Through the differentiated design of the capillary 320, the heat sink can precisely match the thermal management requirements of different scenarios, achieving an optimal balance between efficiency, cost, and reliability.

[0041] In an optional embodiment, the phase change medium is high-purity water or ethanol. High-purity water has a latent heat of vaporization of 2260 kJ / kg, allowing it to absorb more heat per unit mass, making it suitable for high-power heat dissipation scenarios. Ethanol has a freezing point as low as -114°C, making it suitable for extreme low-temperature environments and preventing the phase change medium from freezing and failing. By rationally selecting the phase change medium, the heat sink can precisely match the characteristics of the heat source with environmental conditions, maximizing heat dissipation efficiency and reliability.

[0042] In an optional embodiment, as shown in FIG1, the frame 100 is further provided with a second opening 100D, which is located on the opposite side of the first opening 100C. The end face of the cold plate 200 away from the heat spreader 300 faces the second opening 100D. The liquid inlet 210B and the liquid outlet 210C are both located on the end face of the cold plate 200 away from the heat spreader 300. By providing the second opening 100D on the opposite side of the frame 100, the liquid inlet 210B and the liquid outlet 210C on the cold plate 200 are located at the second opening 100D, which facilitates the connection of the liquid inlet 210B and the liquid outlet 210C to the pipes, and has the advantage of convenient operation.

[0043] In an optional embodiment, as shown in FIG1, the heat sink further includes a fastener 110, which is disposed on the frame 100 and is used to connect the frame 100 to the device to be cooled. The heat sink can be installed on the component that needs to be cooled by the fastener 110, so that the heat sink and the component are tightly connected, thereby transferring the heat on the component to the heat sink.

[0044] In an exemplary embodiment, the fastener 110 is a bolt, and the frame 100 is connected to the device that needs to dissipate heat by means of the bolt.

[0045] On the other hand, this application embodiment also provides a heat dissipation device, including a water pump, a first pipe, a second pipe, a water tank and a heat dissipation plate as described in any of the above embodiments. The output end of the water tank and the liquid inlet 210B of the heat dissipation plate are connected through the first pipe, and the liquid outlet 210C of the heat dissipation plate and the input end of the water tank are connected through the second pipe. The water tank, the heat dissipation plate, the first pipe and the second pipe are sequentially connected to form a circulation pipe, and the water pump is disposed in the circulation pipe.

[0046] The heat dissipation device described in this embodiment uses a water pump to input the liquid cooling medium from the water tank into the heat dissipation plate, thereby removing heat from the heat dissipation plate and achieving the purpose of cooling. The heat dissipation plate uses a phase change medium in the heat spreader 300. Relying on the phase change heat transfer of the liquid evaporation and gas condensation of the phase change medium, the heat on the component that needs to be cooled is transferred to the cold plate 200 and carried away by the liquid cooling medium. Compared with the convection heat transfer of the cold plate 200 alone, more heat can be transferred in a short time, which can significantly enhance the heat dissipation capacity of the heat dissipation plate and reduce the temperature of the component. It has the advantages of high heat exchange efficiency and strong heat dissipation capacity.

[0047] On the other hand, embodiments of this application also provide a computing device, including a computing element and a heat sink as described in any of the above embodiments, wherein the heat sink is mounted on the computing element.

[0048] The computing device described in this embodiment dissipates heat from the computing element by installing a heat dissipation device on the computing element, ensuring stable operation of the computing element. The heat dissipation device is equipped with a heat sink plate, which is connected to the computing element. The heat sink plate uses a phase change medium placed in the heat exchange plate 300. Relying on the phase change heat transfer of the liquid evaporation and gas condensation of the phase change medium, the heat on the element that needs to be cooled is transferred to the cold plate 200 and carried away by the liquid cooling medium. Compared with the convection heat transfer of the cold plate 200 alone, more heat can be transferred in a short time, which can significantly enhance the heat dissipation capacity of the heat sink plate and thus reduce the temperature of the element. Under the same power consumption computing element, the heat sink plate of this embodiment can tolerate a higher inlet water temperature, which can reduce the power of the heat dissipation device and save the operating cost of the heat dissipation device. It has the advantages of high heat exchange efficiency and strong heat dissipation capacity.

[0049] The technical features of the above embodiments can be combined in any way. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0050] The embodiments described above are merely illustrative of several implementation methods of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims. [Simplified Explanation of the Diagram]

[0051] Figure 1 is a schematic diagram of the structure of the heat sink according to an embodiment of this application. Figure 2 is a schematic diagram of the structure of the heat sink according to another embodiment of this application.

Claims

1. A heat sink, comprising: The frame includes a first accommodating cavity and a second accommodating cavity, which are connected. The frame has a first opening on its end face, which is connected to the second accommodating cavity. A cold plate is installed in the first accommodating cavity. The cold plate includes a first housing with a liquid cooling cavity containing a liquid cooling medium. The first housing has an inlet and an outlet, both of which are connected to the liquid cooling cavity. A heat spreader is installed in the second accommodating cavity. The heat spreader includes a second housing, a capillary wick, and a support member. The second housing has an evaporation end face and a condensation end face. The evaporation end face faces the first opening, the condensation end face is connected to the cold plate, the second shell has a vacuum chamber, the capillary wick covers the inner wall of the vacuum chamber, the support members include multiple members, one end of the support member is connected to the evaporation end face and is obliquely arranged to the evaporation end face, the other end of the support member is connected to the condensation end face and is obliquely arranged to the condensation end face, and the multiple support members are connected end to end in the vacuum chamber to form a zigzag line structure, or one end of the support member is perpendicularly connected to the evaporation end face, and the other end of the support member is perpendicularly connected to the condensation end face, and the vacuum chamber is provided with a phase change medium.

2. The heat sink as described in claim 1, wherein the heat sink further includes a plurality of fins, the plurality of fins being spaced apart in the liquid cooling cavity, and the plurality of fins being connected to the end face of the first housing near the heat spreader.

3. The heat sink as described in claim 1, wherein the capillary core is a wire mesh capillary core, a sintered capillary core, or a grooved capillary core.

4. The heat sink as described in claim 1, wherein the phase change medium is high-purity water or ethanol.

5. The heat sink as described in claim 1, wherein the frame further comprises a second opening, the second opening being disposed on the side opposite to the first opening, the end face of the cold plate away from the heat spreader facing the second opening, and the liquid inlet and the liquid outlet being disposed on the end face of the cold plate away from the heat spreader.

6. The heat sink as claimed in claim 1, wherein the heat sink further includes a fastener disposed on the frame, the fastener being used to connect the frame to the device to be cooled.

7. A heat dissipation device, comprising: The water pump, the first pipe, the second pipe, the water tank, and the heat dissipation plate as described in any one of claims 1-6, wherein the output end of the water tank and the liquid inlet of the heat dissipation plate are connected through the first pipe, the liquid outlet of the heat dissipation plate and the input end of the water tank are connected through the second pipe, the water tank, the heat dissipation plate, the first pipe and the second pipe are sequentially connected to form a circulation pipe, and the water pump is disposed in the circulation pipe.

8. A computing device, comprising: The computing element and the heat sink of claim 7, wherein the heat dissipation device is mounted on the computing element.

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