Heat dissipation plate, heat dissipation device and computing device

Abstract

A heat dissipation plate includes a frame, a cold plate and a vapor chamber. The frame is provided with a first accommodation chamber, a second accommodation chamber and a first opening. The first accommodation chamber is in space connection with the second accommodation chamber. The first opening is in space connection with the second accommodation chamber. The cold plate is mounted in the first accommodation chamber. The cold plate is provided with a liquid cooling chamber in which a liquid coolant is provided. The cold plate is provided with a liquid inlet and a liquid outlet that are in space connection with the liquid cooling chamber. The vapor chamber is mounted in the second accommodation chamber. The vapor chamber is provided with an evaporation surface disposed facing the first opening and a condensation surface connected to the cold plate. The condensation surface of the vapor chamber is provided with a plurality of protrusions that are spaced apart and arranged along a first direction of the heat dissipation plate. The cold plate is provided with a plurality of grooves at one end thereof connected to the vapor chamber, with each protrusion disposed in a corresponding groove. The vapor chamber is provided with a phase-change medium therein.

Description

[Technical Field]

[0001] This application relates to the field of computer accessories technology, and in particular to a heat sink, heat dissipation device and computing device. [Previous Technology]

[0002] With the acceleration of global digitalization and the explosive growth of computing power demand, server chips are becoming increasingly powerful and have higher and higher requirements for heat dissipation during iterative upgrades.

[0003] To meet the increasingly demanding heat dissipation requirements of server chips, the heat dissipation capacity of heat dissipation devices needs to be continuously improved. Current heat dissipation devices are cold plate heat sinks, which rely on liquid cooling media flowing inside the cold plate to remove surface heat from the chip. However, the convective heat transfer capacity of this single-phase liquid is limited, making it difficult to meet the heat dissipation requirements of high-power chips. Therefore, current heat dissipation devices suffer from low heat exchange efficiency and poor heat dissipation capacity. [Summary of the Invention]

[0004] Based on this, it is necessary to provide a heat sink, a heat sink device, and a computing device to address the problems of low heat exchange efficiency and poor heat dissipation capacity of heat dissipation devices.

[0005] This invention provides a heat sink, comprising:

[0006] A frame, the frame having a first receiving cavity, a second receiving cavity and a first opening, the first receiving cavity communicating with the second receiving cavity, and the first opening communicating with the second receiving cavity;

[0007] Cold plate, the cold plate is installed in the first accommodating cavity, the cold plate is provided with a liquid cooling cavity, the liquid cooling cavity is provided with a liquid cooling medium, the cold plate is provided with a liquid inlet and a liquid outlet, and both the liquid inlet and the liquid outlet are connected to the liquid cooling cavity;

[0008] and a heat spreader plate, the heat spreader plate being installed in the second accommodating cavity, the heat spreader plate having an evaporation end face and a condensation end face, the evaporation end face being disposed facing the first opening, the condensation end face being connected to the cold plate, the heat spreader plate having a plurality of protrusions on the condensation end face, the protrusions being spaced apart along the first direction of the heat dissipation plate, the end of the cold plate connected to the heat spreader plate having a plurality of grooves, the protrusions being disposed in the grooves one by one, the heat spreader plate having a phase change medium inside.

[0009] In one embodiment, the heat spreader includes a capillary wick, the heat spreader is provided with a first vacuum chamber, the phase change medium is disposed in the first vacuum chamber, the protrusion is provided with a second vacuum chamber, the second vacuum chamber is in communication with the first vacuum chamber, and the capillary wick covers the inner wall of the first vacuum chamber and / or the inner wall of the second vacuum chamber.

[0010] In one embodiment, the heat spreader includes a support member, one end of which is connected to the evaporation end face and the other end of which is connected to the condensation end face.

[0011] In one embodiment, the support member includes a plurality of supports, one end of which is obliquely arranged to the evaporation end face, and the other end of which is obliquely arranged to the condensation end face. The plurality of supports are connected end to end in the first vacuum cavity to form a zigzag structure.

[0012] Alternatively, one end of the support is perpendicularly connected to the evaporation end face, and the other end of the support is perpendicularly connected to the condensation end face.

[0013] In one embodiment, the frame is further provided with a limiting part, which is connected to one end of the frame near the first opening.

[0014] In one embodiment, the frame is further provided with a second opening, which is located on the side opposite to the first opening. The end face of the cold plate away from the heat spreader faces the second opening, and the liquid inlet and the liquid outlet are both located on the end face of the cold plate away from the heat spreader.

[0015] In one embodiment, the heat sink further includes a fastener disposed on the frame for connecting the frame to the component to be cooled.

[0016] In one embodiment, the fastener includes two fasteners, and the fasteners are bolts. The two bolts are respectively disposed on both sides of the frame. The frame is provided with connecting holes, and the bolts are connected to the components to be cooled through the connecting holes.

[0017] The present invention also provides a heat dissipation device, including a water pump, a first pipe, a second pipe, a water tank, and a heat dissipation plate as described in any of the above embodiments. The output end of the water tank and the liquid inlet of the heat dissipation plate are connected through the first pipe, and the liquid outlet of the heat dissipation plate and the input end of the water tank are connected through the second pipe. The water tank, the heat dissipation plate, the first pipe, and the second pipe are sequentially connected to form a circulation pipe, and the water pump is disposed in the circulation pipe.

[0018] The present invention also provides a computing device, including a computing element and a heat sink as described in the above embodiments, wherein the heat sink is mounted on the computing element.

[0019] The aforementioned heat dissipation plate, by installing a cold plate in the first accommodating cavity of the frame and a heat spreader in the second accommodating cavity of the frame, connects the condensation end face of the cold plate and the heat spreader. The condensation end face of the heat spreader is connected to multiple protrusions, and the cold plate is provided with grooves so that the protrusions fit into the grooves. The evaporation end face of the heat spreader is used to install on the component to be cooled. The heat of the component to be cooled is transferred to the heat spreader, causing the phase change medium to absorb heat and evaporate from liquid to gas. After the phase change medium becomes gas, it rises into the protrusions. Since the cold plate inputs liquid cooling medium into the liquid cooling cavity through the liquid inlet, the groove of the cold plate wraps around the protrusions of the heat spreader, thereby increasing the contact area between the cold plate and the heat spreader, so that the heat of the heat spreader is transferred to the cold plate more quickly, causing the evaporated gaseous phase change medium to condense into a liquid phase change medium. The alternating process of evaporation and condensation inside the heat spreader will remove a large amount of heat. Therefore, relying on phase change heat transfer through liquid evaporation and gas condensation can transfer more heat in a short time compared to relying solely on convection heat transfer through a cold plate. This can significantly enhance the heat dissipation capacity of the heat sink, thereby reducing the temperature of the components. It has the advantages of high heat exchange efficiency and strong heat dissipation capacity.

[0020] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention.

Implementation Method

[0021] To make the above-mentioned objects, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0022] In the description of this application, it should be understood that if terms such as “center”, “longitudinal”, “horizontal”, “length”, “width”, “thickness”, “up”, “down”, “front”, “back”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inner”, “outer”, “clockwise”, “counterclockwise”, “axial”, “radial”, “circumferential” appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the diagram, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application.

[0023] Furthermore, if the terms "first" or "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, if the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise expressly and specifically defined.

[0024] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., shall be interpreted broadly. For example, they may refer to a fixed connection, a detachable connection, or an integral connection; they may refer to a mechanical connection or an electrical connection; they may refer to a direct connection or an indirect connection through an intermediate medium; they may refer to the internal connection of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0025] In this application, unless otherwise expressly specified and limited, if a description such as "above" or "below" the second feature appears, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, "above," "on top of," and "over" the second feature may mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature may mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0026] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intermediate element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intermediate element present. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0027] Referring to Figure 1, a schematic diagram of the structure of a heat sink in one embodiment of this application is shown. The heat sink includes a frame 100, a cold plate 200, and a heat spreader 300. The frame 100 is provided with a first accommodating cavity 100A, a second accommodating cavity 100B, and a first opening 100C. The first accommodating cavity 100A communicates with the second accommodating cavity 100B, and the first opening 100C communicates with the second accommodating cavity 100B. The cold plate 200 is installed in the first accommodating cavity 100A. The cold plate 200 is provided with a liquid cooling cavity 210A, which is provided with a liquid cooling medium. The cold plate 200 is provided with a liquid inlet 210B and a liquid outlet 210C, both of which communicate with the liquid cooling cavity 210A. A heat spreader 300 is installed in the second accommodating cavity 100B. The heat spreader 300 has an evaporation end face 311 and a condensation end face 312. The evaporation end face 311 faces the first opening 100C, and the condensation end face 312 is connected to the cold plate 200. The heat spreader 300 has multiple protrusions 301 on the condensation end face 312, which are spaced apart along the first direction of the heat sink. The end of the cold plate 200 connected to the heat spreader 300 has multiple grooves 210D, and the protrusions 301 are correspondingly arranged in the grooves 210D. The heat spreader 300 contains a phase change medium. The first direction of the heat sink is the length direction of the heat sink, as shown by the X-axis direction in Figure 1.

[0028] In an optional embodiment, the frame 100 is a cuboid structure, and the cold plate 200 and the heat spreader 300 are stacked inside the frame 100.

[0029] In an optional embodiment, as shown in FIG1, the first accommodating cavity 100A is located on the upper layer of the second accommodating cavity 100B, and the heating element to be installed is located on the lower layer of the second accommodating cavity 100B. That is, the first accommodating cavity 100A is disposed at the end of the second accommodating cavity 100B away from the heating element, and the cold plate 200 is connected to the end of the heat spreader 300 away from the heating element.

[0030] The heat dissipation plate described in this application embodiment is configured such that a cold plate 200 is installed in the first accommodating cavity 100A of the frame 100, and a heat spreader 300 is installed in the second accommodating cavity 100B of the frame 100. The cold plate 200 is connected to the condensation end face 312 of the heat spreader 300, which is connected to a plurality of protrusions 301. The cold plate 200 is provided with a groove 210D, so that the protrusions 301 fit into the groove 210D. The evaporation end face 311 of the heat spreader 300 is used to be installed on the component to be cooled. The heat of the component to be cooled is transferred to the heat spreader 300, causing a phase change. The medium absorbs heat and evaporates from liquid to gas, as shown by the arrow in the heat spreader 300 of Figure 1. After the phase change medium becomes gas, it rises into the protrusion 301. Since the cold plate 200 introduces liquid cooling medium into the liquid cooling cavity 210A through the liquid inlet 210B, the groove 210D of the cold plate 200 covers the protrusion 301 of the heat spreader 300. In other words, the protrusion 301 acts as a heat dissipation fin of the heat spreader 300, thereby increasing the contact area between the cold plate 200 and the heat spreader 300, allowing the heat from the heat spreader 300 to be transferred to the cold plate 200 more quickly, causing the evaporated gaseous phase change medium to condense into a liquid phase change medium. The alternating process of evaporation and condensation inside the heat spreader 300 carries away a large amount of heat.

[0031] The heat sink described in this application embodiment, by setting a phase change medium in the heat spreader 300, relies on the phase change heat transfer of the liquid evaporation and gas condensation of the phase change medium to transfer the heat on the component that needs to be cooled to the cold plate 200 and be carried away by the liquid cooling medium. Compared with the heat transfer of the cold plate 200 alone, it can transfer more heat in a short time, which can significantly enhance the heat dissipation capacity of the heat sink and reduce the temperature of the component. It has the advantages of high heat exchange efficiency and strong heat dissipation capacity.

[0032] In an exemplary embodiment, the heat sink works by having its evaporation end face 311 contact the encapsulation surface of the component to be cooled through a thermally conductive contact material. The thermally conductive contact material can be thermal paste, thermal pad, thermal sealant, etc.

[0033] In some embodiments, as shown in FIG1, the heat spreader 300 includes a capillary wick 320, and the heat spreader 300 is provided with a first vacuum chamber 310A, in which a phase change medium is disposed. A protrusion 301 is provided with a second vacuum chamber 301A, which communicates with the first vacuum chamber 310A. The capillary wick 320 covers the inner wall of the first vacuum chamber 310A and / or the inner wall of the second vacuum chamber 301A. By providing a sealed first vacuum chamber 310A inside the heat spreader 300 and a second vacuum chamber 301A communicating with the first vacuum chamber 310A on the protrusion 301, the sealed first vacuum chamber 310A and the second vacuum chamber 301A can ensure that the phase change medium undergoes efficient phase change circulation within the heat spreader 300. The phase change medium is placed in the first vacuum chamber 310A. When the phase change medium is heated, it becomes gaseous and rises to the second vacuum chamber 301A. The protrusion 301 acts as a heat dissipation part of the heat spreader 300, accelerating the heat transfer to the cold plate 200, so that the gaseous phase change medium turns back into a liquid phase change medium. The capillary wick 320 covers the inner wall of the first vacuum chamber 310A and the inner wall of the second vacuum chamber 301A. Driven by capillary force, the liquid phase change medium condensed in the protrusion 301 flows back to the evaporation end face 311, forming a circulation reflux of the phase change medium.

[0034] Further, the heat spreader 300 includes a support member 330, one end of which is connected to the evaporation end face 311, and the other end of which is connected to the condensation end face 312. A support member 330 is also provided inside the first vacuum chamber 310A, with both ends of the support member 330 connected to the evaporation end face 311 and the condensation end face 312 respectively, thereby providing support for the evaporation end face 311 and the condensation end face 312, preventing the heat spreader 300 from being deformed under pressure, and maintaining the stability of the first vacuum chamber 310A.

[0035] In an exemplary embodiment, the support 330 is a cylindrical structure, with the two ends of the cylinder connected to the evaporation end face 311 and the condensation end face 312, respectively.

[0036] In one exemplary embodiment, the heat spreader 300 is made of a high thermal conductivity metal, such as copper or a copper-aluminum alloy, thereby improving the thermal conductivity of the heat spreader 300 and thus improving the heat dissipation efficiency of the heat sink. In other embodiments, the heat spreader 300 may also be made of aluminum to suit certain lightweight applications.

[0037] In an exemplary embodiment, the support member 330 is made of the same metal material as the heat spreader 300, so that the support member 330 provides a certain strength support for the heat spreader 300.

[0038] In an optional embodiment, the protrusion 301 and the heat spreader 300 are integrally formed and connected. By configuring the protrusion 301 to be integrally connected with the heat spreader 300, the first vacuum chamber 310A and the second vacuum chamber 301A are configured as sealed vacuum chambers, thereby improving the sealing performance and stability of the first vacuum chamber 310A and the second vacuum chamber 301A, and thus improving the stability of the heat sink in use.

[0039] In an optional embodiment, as shown in FIG1, the support member 330 includes multiple members. One end of the support member 330 is obliquely arranged with the evaporation end face 311, and the other end of the support member 330 is obliquely arranged with the condensation end face 312. The multiple support members 330 are connected end to end in the first vacuum cavity 310A to form a zigzag structure. By setting the end faces of the support member 330 and the heat spreader 300 to an inclined state, and connecting the multiple support members 330 to form a zigzag structure, the support structure of the support member 330 is made more stable, avoiding deformation of the evaporation end face 311 and the condensation end face 312 of the heat spreader 300, which would result in insufficient connection between the heat spreader 300 and the cold plate 200, thereby avoiding affecting the heat conduction and improving the heat dissipation efficiency of the heat sink. Moreover, the inclined state of the support member 330 can also be used to guide the phase change medium condensed into a liquid state, so that the deformable medium forms a circulation.

[0040] In other embodiments, as shown in FIG2, one end of the support member 330 is perpendicularly connected to the evaporation end face 311, and the other end of the support member 330 is perpendicularly connected to the condensation end face 312. Setting the support member 330 to be perpendicularly connected to the evaporation end face 311 and the condensation end face 312 can also provide support for the heat spreader 300 and prevent the heat spreader 300 from deforming.

[0041] In an optional embodiment, as shown in FIG1, the frame 100 is further provided with a limiting part 120, which is connected to one end of the frame 100 near the first opening 100C. By providing the limiting part 120 at one end of the first opening 100C, when the heat sink is installed on the component to be cooled, the limiting part 120 can be locked onto the side of the component, thereby making the heat sink installation more accurate, ensuring that the heat dissipation plate 300 of the heat sink corresponds to the position of the component, and ensuring the heat dissipation effect of the heat sink.

[0042] In an exemplary embodiment, a gap is provided between the heat spreader 300 and the first opening 100C so that the evaporation end face 311 of the frame 100 protruding from the heat spreader 300 forms a limiting portion 120.

[0043] In an exemplary embodiment, as shown in FIG2, the evaporation end face 311 of the heat spreader 300 is flush with the first opening 100C. By confining the heat spreader 300 inside the second receiving cavity 100B of the frame 100, the heat spreader 300 is ensured to be stably installed.

[0044] In an optional embodiment, the capillary 320 is a wire mesh capillary, a sintered capillary, or a grooved capillary. The wire mesh capillary is composed of multiple layers of woven metal wires stacked together, exhibiting high permeability and low flow resistance for the gaseous phase change medium. The sintered capillary is a porous structure formed by high-temperature sintering of metal powder, possessing extremely strong capillary force, enabling rapid pumping of the phase change medium back to the evaporation end face 311. The grooved capillary has micro-grooves formed on the inner wall of the heat spreader 300 through mechanical or chemical etching, opening diffusion channels for the gaseous phase change medium and achieving the highest permeability. Through the differentiated design of the capillary 320, the heat sink can precisely match the thermal management requirements of different scenarios, achieving an optimal balance between efficiency, cost, and reliability.

[0045] In an optional embodiment, the phase change medium is high-purity water or ethanol. High-purity water has a latent heat of vaporization of 2260 kJ / kg, allowing it to absorb more heat per unit mass, making it suitable for high-power heat dissipation scenarios. Ethanol has a freezing point as low as -114°C, making it suitable for extreme low-temperature environments and preventing the phase change medium from freezing and failing. By rationally selecting the phase change medium, the heat sink can precisely match the characteristics of the heat source with environmental conditions, maximizing heat dissipation efficiency and reliability.

[0046] In an optional embodiment, as shown in FIG1, the frame 100 is further provided with a second opening 100D, which is located on the opposite side of the first opening 100C. The end face of the cold plate 200 away from the heat spreader 300 faces the second opening 100D. The liquid inlet 210B and the liquid outlet 210C are both located on the end face of the cold plate 200 away from the heat spreader 300. By providing the second opening 100D on the opposite side of the frame 100, the liquid inlet 210B and the liquid outlet 210C on the cold plate 200 are located at the second opening 100D, which facilitates the connection of the liquid inlet 210B and the liquid outlet 210C to the pipes, and has the advantage of convenient operation.

[0047] In an optional embodiment, as shown in FIG1, the heat sink further includes a fastener 110, which is disposed on the frame 100 and is used to connect the frame 100 to the component to be cooled. The heat sink can be installed on the component that needs to be cooled by the fastener 110, so that the heat sink and the component are tightly connected, thereby transferring the heat on the component to the heat sink.

[0048] In an exemplary embodiment, the fastener 110 includes two fasteners, and the fasteners 110 are bolts. The two bolts are respectively disposed on both sides of the frame 100. The frame 100 is provided with connecting holes, and the bolts are connected to the components to be cooled through the connecting holes. By connecting the components to be cooled with bolts, the heat sink is fixed to the components that need to be cooled, so that the heat sink and the components are tightly connected, ensuring the heat dissipation effect of the heat sink.

[0049] In another exemplary embodiment, the fastener 110 is a snap fastener, and the component to be cooled is provided with a claw that cooperates with the snap fastener. The snap fastener is used to detachably connect with the claw of the component to be cooled, thereby making the heat sink firmly connected to the component to be cooled, and also having the advantage of easy disassembly.

[0050] On the other hand, this application embodiment also provides a heat dissipation device, including a water pump, a first pipe, a second pipe, a water tank and a heat dissipation plate as described in any of the above embodiments. The output end of the water tank and the liquid inlet 210B of the heat dissipation plate are connected through the first pipe, and the liquid outlet 210C of the heat dissipation plate and the input end of the water tank are connected through the second pipe. The water tank, the heat dissipation plate, the first pipe and the second pipe are sequentially connected to form a circulation pipe, and the water pump is disposed in the circulation pipe.

[0051] The heat dissipation device described in this embodiment uses a water pump to input the liquid cooling medium from the water tank into the heat dissipation plate, thereby removing heat from the heat dissipation plate and achieving the purpose of cooling. The heat dissipation plate uses a phase change medium in the heat spreader 300. Relying on the phase change heat transfer of the liquid evaporation and gas condensation of the phase change medium, the heat on the component that needs to be cooled is transferred to the cold plate 200 and carried away by the liquid cooling medium. Compared with the convection heat transfer of the cold plate 200 alone, it can transfer more heat in a short time, which can significantly enhance the heat dissipation capacity of the heat dissipation plate and reduce the temperature of the component. It has the advantages of high heat exchange efficiency and strong heat dissipation capacity.

[0052] On the other hand, embodiments of this application also provide a computing device, including a computing element and a heat sink as described in any of the above embodiments, wherein the heat sink is mounted on the computing element.

[0053] The computing device described in this embodiment dissipates heat from the computing elements by installing a heat dissipation device on them, ensuring stable operation of the computing elements. The heat dissipation device is equipped with a heat sink plate, which is connected to the computing elements. The heat sink plate uses a phase change medium within the heat exchange plate 300. Through the phase change heat transfer of the liquid evaporation and gas condensation of the phase change medium, the heat from the elements requiring heat dissipation is transferred to the cold plate 200 where it is carried away by the liquid cooling medium. Compared to relying solely on convection heat transfer from the cold plate 200, this method can transfer more heat in a shorter time, significantly enhancing the heat dissipation capacity of the heat sink plate and thus reducing the temperature of the elements. For computing elements with the same power consumption, the heat sink plate in this embodiment can tolerate higher inlet water temperatures, reducing the power consumption of the heat dissipation device and saving operating costs. It has the advantages of high heat exchange efficiency and strong heat dissipation capacity.

[0054] The technical features of the above embodiments can be combined in any way. In order to make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0055] The embodiments described above are merely examples of several implementation methods of this application, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the patent application. It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims. [Simplified Explanation of the Diagram]

[0056] Figure 1 is a schematic diagram of the structure of the heat sink according to an embodiment of this application. Figure 2 is a schematic diagram of the structure of the heat sink according to another embodiment of this application.

Claims

1. A heat sink, comprising: The frame includes a first accommodating cavity, a second accommodating cavity, and a first opening. The first accommodating cavity and the second accommodating cavity are connected, and the first opening is also connected to the second accommodating cavity. A cold plate is installed in the first accommodating cavity and has a liquid cooling chamber containing a liquid cooling medium. The cold plate has an inlet and an outlet, both of which are connected to the liquid cooling chamber. A heat spreader is installed in the second accommodating cavity and has an evaporation end face and a condensation end face. The evaporation end face faces the first opening, and the condensation end face is connected to the cold plate. The heat spreader has multiple protrusions on the condensation end face, spaced apart along a first direction of the heat sink. The end of the cold plate connected to the heat spreader has multiple grooves. The protrusions are correspondingly disposed in the grooves. The heat spreader includes a capillary wick. The heat spreader has a first vacuum chamber containing a phase change medium. The protrusions have a second vacuum chamber connected to the first vacuum chamber. The capillary wick covers the inner wall of the first vacuum chamber and / or the inner wall of the second vacuum chamber. The heat spreader includes multiple support members. One end of each support member is connected to the evaporation end face and is obliquely arranged to the evaporation end face. The other end of each support member is connected to the condensation end face and is obliquely arranged to the condensation end face. The multiple support members are connected end to end in the first vacuum chamber to form a zigzag structure. Alternatively, one end of each support member is perpendicularly connected to the evaporation end face, and the other end of each support member is perpendicularly connected to the condensation end face.

2. The heat sink as claimed in claim 1, wherein the frame is further provided with a limiting portion connected to one end of the frame near the first opening.

3. The heat sink as described in claim 1, wherein the frame further comprises a second opening, the second opening being disposed on the side opposite to the first opening, the end face of the cold plate away from the heat spreader facing the second opening, and the liquid inlet and the liquid outlet being disposed on the end face of the cold plate away from the heat spreader.

4. The heat sink as claimed in claim 1, wherein the heat sink further includes fasteners disposed on the frame for connecting the frame to the component to be cooled.

5. The heat sink as described in claim 4, wherein the fasteners include two bolts, the two bolts are respectively disposed on both sides of the frame, the frame is provided with connecting holes, and the bolts are connected to the components to be cooled through the connecting holes.

6. A heat dissipation device, comprising: The water pump, the first pipe, the second pipe, the water tank, and the heat dissipation plate as described in any one of claims 1-5, wherein the output end of the water tank and the liquid inlet of the heat dissipation plate are connected through the first pipe, the liquid outlet of the heat dissipation plate and the input end of the water tank are connected through the second pipe, the water tank, the heat dissipation plate, the first pipe and the second pipe are sequentially connected to form a circulation pipe, and the water pump is installed in the circulation pipe.

7. A computing device, comprising: The computing element and the heat sink described in claim 6, wherein the heat dissipation device is mounted on the computing element.

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