Heat dissipation module, assembling method thereof, and electronic device

Abstract

A heat dissipation module, an assembling method thereof, and an electronic device are provided. The heat dissipation module is used to cool a heat source on a circuit board and includes a seat, a connecting frame, and a heat dissipator. The seat has a plurality of first buckles and is arranged on the circuit board such that the heat source is located on a central or near the central of the seat. The connecting frame has a limiting structure and a plurality of second buckles respectively buckling the first buckles to fix the connecting frame to the seat. The limiting structure limits at least part of the heat dissipator in the connecting frame and makes the heat dissipator to attach on the heat source along a vertical direction. The heat dissipator is therefore quickly, stably, and precisely installing on the circuit board, tightly attaching to the heat source, and avoiding deformation of the heat dissipator due to excessive or uneven force during installation.

Images