Three-dimensional structure assembling method and three-dimensional structure assembling system
TW202638282APending Publication Date: 2026-09-16INVENTEC CORP
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Patent Information
- Application Number
- TW114109024
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-03-12
- Publication Date
- 2026-09-16
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Abstract
A three-dimensional structure assembling method comprises using a three-dimensional (3D) modeling module to generate training data for training an artificial intelligence (AI) model, selecting a component to be built on a part, and inputting a projection contour of the part and a buildable range of the component in the part to the AI model through the 3D modeling module, inferring a type of the component and a position of the component built in the part based on the AI model, and inputting the type of the component and the position of the component built in the part to the 3D modeling module, so that the 3D modeling module assembles the component onto the part based on the type and the position for generating an assembled part structure.
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