Method for evaluating heat sensitive structure and system

TW202638290APending Publication Date: 2026-09-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
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Patent Information

Application Number
TW114116629
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-14
Filing Date
2025-05-02
Publication Date
2026-09-16

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Abstract

A temperature derating methodology in thermal-aware electromigration (EM) analysis may comprise identifying a heat sensitive structure, a first heat generating structure, and a first heat dissipating structure. The temperature derating methodology comprises adjustments of an evaluation temperature for the heat sensitive structure by adjusting an operation temperature of the first heat generating structure and calculating a temperature increase for the heat sensitive structure.
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