Surface mounting method for protective elements and protective elements
TW202638467APending Publication Date: 2026-09-16SCHOTT JAPAN CORP
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Patent Information
- Application Number
- TW115104921
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-21
- Filing Date
- 2026-02-09
- Publication Date
- 2026-09-16
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Abstract
The objective of this invention is to provide a surface-mount protective element that offers excellent quick-break performance and is easy to process. The solution comprises an insulating substrate, a plurality of electrodes spaced apart on one side of the insulating substrate, and a fusible element that is bonded to and electrically connected to each electrode. The fusible element has a bonding portion that bonds to each electrode and a fusible portion that connects to each electrode. The solidus temperature of the fusible element is lower than the reflow soldering temperature. The fusible element is configured to partially melt by reflow soldering, causing the fusible portion to neck.
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