Lower electrode assembly and plasma treatment device

TW202638484APending Publication Date: 2026-09-16ADVANCED MICRO FAB EQUIP INC CHINA
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Patent Information

Application Number
TW114140419
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-29
Filing Date
2025-10-20
Publication Date
2026-09-16

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    Figure TWG2TA001076336_003
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Abstract

A lower electrode assembly and a plasma processing apparatus are disclosed. The lower electrode assembly includes: a first base for supporting a substrate, wherein a first cooling channel is provided therein; a second base disposed around the first base, forming two separate components, and the second base contains a second cooling channel; a heat insulation structure disposed between the first base and the second base for independently controlling the temperature of the first base and the second base; an edge ring assembly disposed above the second base; and a device plate disposed below the first base and the second base, wherein the first base and the second base are fixedly connected to the device plate. The lower electrode assembly can independently control the temperature of the edge ring assembly.
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