Antenna apparatus and physiological signal detection system

Abstract

An antenna apparatus includes a signal source substrate, a feeding substrate, a conductive substrate, a jointing element and a modulation structure. The feeding substrate is partially disposed on the signal source substrate. The feeding substrate includes a second base. A first portion of the second base is disposed on the signal source substrate. A second portion of the second base is disposed outside an area of ​​the signal source substrate. The conductive substrate is disposed on the feeding substrate. The jointing element joints the conductive substrate, the feeding substrate and the signal source substrate. The modulation structure is disposed on the second portion of the feeding substrate. In addition, a physiological signal detection system including the antenna apparatus is also provided.

Description

[Technical Field]

[0001] This invention relates to an electronic device and a detection system, and more particularly to an antenna device and a physiological signal detection system. [Previous Technology]

[0002] Wireless communication technology is ubiquitous in modern life. For example, smartphones typically have systems using wireless communication technologies, such as Wireless Wide Area Network (WWAN), Digital Television Broadcasting System (DTV), Global Positioning System (GPS), Wireless Local Area Network (WLAN), Near Field Communication (NFC), Long Term Evolution (LTE), and Wireless Personal Network (WLPN). Furthermore, providing wireless local area network environments has become a necessary facility in major cities or public spaces, and many people even set up their own wireless local area networks at home.

[0003] With the development of 5G technology, in order to ensure that base station signals cover every corner, antenna devices are usually used to reorganize the signals emitted by the base station and then transmit them in different directions. There are many types of antenna devices, one of which may include a signal source substrate, a feed substrate, and a modulation structure disposed on the feed substrate and including a liquid crystal layer. The signal source substrate, feed substrate, and modulation structure need to be connected to each other using special connectors. However, the price of special connectors is relatively high, which is not conducive to cost reduction. In addition, special connectors also need to be soldered to the ground electrode of the modulation structure, making assembly difficult. [Summary of the Invention]

[0004] The present invention provides an antenna device with excellent performance.

[0005] An antenna device according to an embodiment of the present invention includes a signal source substrate, a feed substrate, a conductive substrate, a bonding element, and a modulation structure. The signal source substrate includes a first substrate, a signal source line, and a first ground electrode. The first substrate has an upper surface. The signal source line is disposed on the upper surface of the first substrate. The first ground electrode is disposed on the upper surface of the first substrate and is structurally separated from the signal source line. The feed substrate is partially disposed on the signal source substrate. The feed substrate includes a second substrate, a feed signal line, a second ground electrode, and a third ground electrode. The second substrate has opposing upper and lower surfaces. The lower surface of the second substrate of the feed substrate faces the upper surface of the first substrate of the signal source substrate. The second substrate has a first portion and a second portion connected to each other. The first portion of the second substrate is disposed on the signal source substrate, and the second portion of the second substrate is disposed outside the area of ​​the signal source substrate. The feed signal line is disposed on the lower surface of the second substrate. A portion of the feed signal line of the feed substrate is stacked on a portion of the signal source line of the signal source substrate. A second ground electrode is disposed on the lower surface of the second substrate and is structurally separated from the feed signal line. The second ground electrode of the feed substrate is stacked on the first ground electrode of the signal source substrate. A third ground electrode is disposed on the upper surface of the second substrate and is electrically connected to the second ground electrode. A conductive substrate is disposed on the feed substrate. The conductive substrate includes a third substrate and a fourth ground electrode. The third substrate has an upper surface. The upper surface of the third substrate faces away from the upper surface of the second substrate of the feed substrate. The fourth ground electrode is disposed on the upper surface of the third substrate and is electrically connected to the third ground electrode of the feed substrate. A bonding element bonds the conductive substrate, the feed substrate, and the signal source substrate. A modulation structure is disposed on a second portion of the feed substrate. The modulation structure includes a fourth substrate, a fifth substrate, a liquid crystal layer, and a fifth ground electrode. The fourth substrate is located between the fifth substrate and the feed substrate. The liquid crystal layer is disposed between the fourth substrate and the fifth substrate. The fifth ground electrode is disposed on the fifth substrate and is located between the liquid crystal layer and the fifth substrate. The fifth substrate has an extension extending beyond the area of ​​the fourth substrate, and the fifth ground electrode has an extension. An extension of the fifth ground electrode is disposed on an extension of the fifth substrate. The fourth ground electrode of the conductive substrate is disposed below the extension of the fifth ground electrode of the modulation structure.

[0006] An antenna device according to an embodiment of the present invention includes a signal source substrate, a feed substrate, a conductive substrate, a bonding element, and a modulation structure. The signal source substrate includes a first substrate, a signal source line, and a first ground electrode. The first substrate has an upper surface. The signal source line is disposed on the upper surface of the first substrate. The first ground electrode is disposed on the upper surface of the first substrate and is structurally separated from the signal source line. The feed substrate is partially disposed on the signal source substrate. The feed substrate includes a second substrate, a feed signal line, a second ground electrode, and a third ground electrode. The second substrate has opposing upper and lower surfaces. The lower surface of the second substrate of the feed substrate faces the upper surface of the first substrate of the signal source substrate. The second substrate has a first portion and a second portion connected to each other. The first portion of the second substrate is disposed on the signal source substrate. The second portion of the second substrate is disposed outside the area of ​​the signal source substrate. The feed signal line is disposed on the lower surface of the second substrate. A portion of the feed signal line of the feed substrate is stacked on a portion of the signal source line of the signal source substrate. A second ground electrode is disposed on the lower surface of the second substrate and is structurally separated from the feed signal line. The second ground electrode of the feed substrate is stacked on the first ground electrode of the signal source substrate. A third ground electrode is disposed on the upper surface of the second substrate and is electrically connected to the second ground electrode. A conductive substrate is disposed on the feed substrate. The conductive substrate includes a third substrate and a fourth ground electrode. The third substrate has an upper surface and a lower surface. The upper surface of the third substrate faces away from the upper surface of the second substrate of the feed substrate, and the lower surface of the third substrate faces the upper surface of the second substrate of the feed substrate. The fourth ground electrode is disposed on one of the upper surface and the lower surface of the third substrate and is electrically connected to the third ground electrode of the feed substrate. A bonding element bonds the conductive substrate, the feed substrate, and the signal source substrate. A modulation structure is disposed on a second portion of the feed substrate. The modulation structure includes a fourth substrate, a fifth substrate, a liquid crystal layer, and a fifth ground electrode. The fourth substrate is located between the fifth substrate and the feed substrate. The liquid crystal layer is disposed between the fourth substrate and the fifth substrate. One of the fourth substrate and the fifth substrate has an extension. An extension of one of the fourth and fifth substrates extends beyond the area of ​​the other of the fourth and fifth substrates. A fifth ground electrode is disposed on one of the fourth and fifth substrates and located between the liquid crystal layer and one of the fourth and fifth substrates. The fifth ground electrode has an extension. The extension of the fifth ground electrode is disposed on the extension of one of the fourth and fifth substrates. The fourth ground electrode of the conductive substrate faces the extension of the fifth ground electrode of the modulation structure and overlaps with the extension of the fifth ground electrode of the modulation structure.

[0007] A physiological signal detection system according to an embodiment of the present invention includes the antenna device described above, a processing element electrically connected to the antenna device, and a response element electrically connected to the processing element.

Implementation Method

[0008] Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same element symbols are used in the drawings and description to denote the same or similar parts.

[0009] It should be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "connected" to another element, it may be directly on or connected to the other element, or an intermediate element may also be present. Conversely, when an element is referred to as being "directly on" or "directly connected" to another element, no intermediate element is present. As used herein, "connection" may refer to a physical and / or electrical connection. Furthermore, "electrical connection" or "coupling" may mean the presence of other elements between the two elements.

[0010] As used herein, “about,” “approximately,” or “substantially” includes the value and the average value within an acceptable range of deviations from a particular value as determined by one of ordinary skill in the art, taking into account the measurement in question and a particular number of errors associated with the measurement (i.e., limitations of the measurement system). For example, “about” may mean within one or more standard deviations of the value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, as used herein, “about,” “approximately,” or “substantially” may be used to select a more acceptable range of deviations or standard deviations depending on the optical, etched, or other properties, and not necessarily apply to all properties with a single standard deviation.

[0011] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will be further understood that terms such as those defined in commonly used dictionaries should be interpreted as having the same meaning as they have in the context of the relevant technology and the present invention, and will not be interpreted as having an idealized or overly formal meaning unless expressly defined herein.

[0012] Figure 1 is a three-dimensional exploded view of an antenna device according to an embodiment of the present invention. Figure 2 is a cross-sectional view of an antenna device according to an embodiment of the present invention. Figure 2 corresponds to line segment A-A' in Figure 1. Figure 3 is a cross-sectional view of an antenna device according to an embodiment of the present invention. Figure 3 corresponds to line segment B-B' in Figure 1. Figure 4 is a top view and a three-dimensional view of the signal source substrate of an antenna device according to an embodiment of the present invention. The modulation structure 600 of Figures 2 and 3 is omitted in Figure 1. The ground electrode 140 of Figures 2 and 3 is omitted in Figure 4.

[0013] Referring to Figures 1, 2, 3, and 4, the antenna device 10 includes a signal source substrate 100. The signal source substrate 100 includes a first substrate 110, a signal source line 120, and a first ground electrode 130. The first substrate 110 has an opposing upper surface 112 and a lower surface 114. The signal source line 120 is disposed on the upper surface 112 of the first substrate 110. The first ground electrode 130 is disposed on the upper surface 112 of the first substrate 110 and is structurally separated from the signal source line 120. In some embodiments, the signal source substrate 100 may further include a first conductive via 150 disposed in the first substrate 110 and electrically connected to the first ground electrode 130. In some embodiments, the signal source substrate 100 may further include a ground electrode 140 disposed on the lower surface 114 of the first substrate 110, wherein the first conductive via 150 is electrically connected to the ground electrode 140 and the first ground electrode 130. In some embodiments, the signal source substrate 100 includes, for example, a double-layer printed circuit board. In some embodiments, the signal source substrate 100 may further include a signal source 160 disposed on the first substrate 110 and electrically connected to the signal source line 120. In some embodiments, the signal source 160 includes, for example, a microwave monolithic integrated circuit (MMIC).

[0014] Figure 5 is a bottom view and a perspective view of the feed substrate and modulation structure of an antenna device according to an embodiment of the present invention. Figure 6 is a bottom view of the feed substrate of an antenna device according to an embodiment of the present invention. Figure 7 is a top view of the feed substrate of an antenna device according to an embodiment of the present invention.

[0015] Referring to Figures 1, 2, 3, 4, and 5, the antenna device 10 further includes a feed substrate 200, partially disposed on the signal source substrate 100. The feed substrate 200 includes a second substrate 210. The second substrate 210 has opposing upper surfaces 212 and lower surfaces 214. The lower surface 214 of the second substrate 210 of the feed substrate 200 faces the upper surface 112 of the first substrate 110 of the signal source substrate 100. The second substrate 210 of the feed substrate 200 has a first portion 210-1 and a second portion 210-2 connected to each other. The first portion 210-1 of the second substrate 210 of the feed substrate 200 is disposed on the signal source substrate 100. The second portion 210-2 of the second substrate 210 of the feed substrate 200 is disposed outside the area of ​​the signal source substrate 100.

[0016] Referring to Figures 1, 3, 5, and 6, the feed substrate 200 further includes a feed signal line 220 disposed on the lower surface 214 of the second substrate 210. Referring to Figures 1, 3, 4, 5, and 6, a portion 222 of the feed signal line 220 of the feed substrate 200 is stacked on a portion 122 of the signal source line 120 of the signal source substrate 100. The portion 222 of the feed signal line 220 and the portion 122 of the signal source line 120 face to face and are in contact. In some embodiments, the portion 222 of the feed signal line 220 and the portion 122 of the signal source line 120 of the signal source substrate 100 may abut against each other and be in contact with each other. In some embodiments, the feed substrate 200 may further include a radiating conductive pattern 250 disposed on the lower surface 214 of the second portion 210-2 of the second substrate 210 and electrically connected to the feed signal line 220.

[0017] Referring to Figures 1, 2, 5, and 6, the feed substrate 200 further includes a second ground electrode 230, disposed on the lower surface 214 of the second substrate 210, and structurally separated from the feed signal line 220. The second ground electrode 230 of the feed substrate 200 is stacked on the first ground electrode 130 of the signal source substrate 100. The second ground electrode 230 of the feed substrate 200 and the first ground electrode 130 of the signal source substrate 100 face each other and are in contact. In some embodiments, the second ground electrode 230 of the feed substrate 200 and the first ground electrode 130 of the signal source substrate 100 may abut against each other and be in contact with each other.

[0018] Referring to Figures 1, 2, 5, 6, and 7, the feed substrate 200 further includes a third ground electrode 240 disposed on the upper surface 212 of the second substrate 210 and electrically connected to the second ground electrode 230. In some embodiments, the feed substrate 200 further includes a second conductive via 260 disposed in the second substrate 210 and electrically connected to the second ground electrode 230 and the third ground electrode 240. In some embodiments, the feed substrate 200 includes, for example, a double-layer printed circuit board, but the present invention is not limited thereto.

[0019] Figure 8 is a partial top view and enlarged schematic diagram of the signal source substrate of an antenna device according to an embodiment of the present invention. Figure 9 is a partial bottom view and enlarged schematic diagram of the feed substrate of an antenna device according to an embodiment of the present invention. Figure 10 is a partial top view and perspective enlarged schematic diagram of an antenna device according to an embodiment of the present invention. Figure 10 is an overlay of Figures 8 and 9.

[0020] Referring to Figures 1, 3, 4, 5, 8, 9, and 10, in some embodiments, the linewidth w2 of a portion 222 of the feed signal line 220 is greater than the linewidth w1 of a portion 122 of the signal source line 120. Therefore, when the feed signal line 220 of the feed substrate 200 and the signal source line 120 of the signal source substrate 100 are assembled in a face-to-face manner, the impedance will be based on the portion 222 of the feed signal line 220 with the wider linewidth w2. This effectively reduces impedance mismatch caused by assembly and / or cutting errors of the feed substrate 200 and the signal source substrate 100, thereby reducing energy reflection.

[0021] In some embodiments, a portion 222 of the feed signal line 220 is disposed on a first portion 210-1 of the second substrate 210, and another portion 224 of the feed signal line 220 is disposed on a second portion 210-2 of the second substrate 210. The portion 222 of the feed signal line 220 is connected to the other portion 224 of the feed signal line 220, and the line width w3 of the other portion 224 of the feed signal line 220 is greater than the line width w2 of the portion 222 of the feed signal line 220.

[0022] Figure 11 is a bottom view of the conductive substrate of an antenna device according to an embodiment of the present invention. Figure 12 is a top view of the conductive substrate of an antenna device according to an embodiment of the present invention. Referring to Figures 1, 2, 3, 11 and 12, the antenna device 10 further includes a conductive substrate 400 disposed on a first portion 210-1 of a feed substrate 200. The conductive substrate 400 includes a third substrate 410. The third substrate 410 has an opposing upper surface 412 and a lower surface 414. The upper surface 412 of the third substrate 410 faces away from the upper surface 212 of the second substrate 210 of the feed substrate 200. The lower surface 414 of the third substrate 410 faces the upper surface 212 of the second substrate 210 of the feed substrate 200. The conductive substrate 400 further includes a fourth ground electrode 420 disposed on one of the upper surface 412 and the lower surface 414 of the third substrate 410, and electrically connected to the third ground electrode 240 of the feed substrate 200. For example, in some embodiments, the fourth ground electrode 420 is disposed on the upper surface 412 of the third substrate 410, but the present invention is not limited thereto. The conductive substrate 400 also includes a ground electrode 430 disposed on the lower surface 414 of the third substrate 410 and electrically connected to the fourth ground electrode 420. Specifically, in some embodiments, the conductive substrate 400 further includes a third conductive via 440 disposed in the third substrate 410 and electrically connected to the fourth ground electrode 420 and the ground electrode 430. The ground electrode 430 of the conductive substrate 400 is stacked on the third ground electrode 240 of the feed substrate 200. The ground electrode 430 of the conductive substrate 400 and the third ground electrode 240 of the feed substrate 200 face each other and are in contact. In some embodiments, the ground electrode 430 of the conductive substrate 400 and the third ground electrode 240 of the feed substrate 200 may abut against each other and be in contact with each other.

[0023] Referring to Figures 1 and 2, the antenna device 10 further includes a bonding element 500, which bonds the conductive substrate 400, the feed substrate 200, and the signal source substrate 100. The bonding element 500 is used to securely stack the conductive substrate 400, the feed substrate 200, and the signal source substrate 100 together. In some embodiments, the bonding element 500 can electrically connect the fourth ground electrode 420 and ground electrode 430 of the conductive substrate 400, the third ground electrode 240 and the second ground electrode 230 of the feed substrate 200, and the first ground electrode 130 and the ground electrode 140 of the signal source substrate 100 to each other.

[0024] For example, in some embodiments, the bonding element 500 includes a first component 510 disposed in a first conductive via 150 of the signal source substrate 100, a second conductive via 260 of the feed substrate 200, and a third conductive via 440 of the conductive substrate 400. In some embodiments, the bonding element 500 further includes a second component 520, with the signal source substrate 100, the feed substrate 200, and the conductive substrate 400 disposed between a portion of the first component 510 and the second component 520. The first component 510 and the second component 520 cooperate to securely stack the conductive substrate 400, the feed substrate 200, and the signal source substrate 100 together. For example, in some embodiments, the first component 510 and the second component 520 are, for example, a screw and a nut, respectively, which are screwed together to securely stack the conductive substrate 400, the feed substrate 200, and the signal source substrate 100 together. However, the invention is not limited thereto. In other embodiments, the bonding element 500 may also be other types of bonding elements.

[0025] Figure 13 is a cross-sectional schematic diagram of the modulation structure of an antenna device according to an embodiment of the present invention. Figures 1, 2, 3 and 5 omit the liquid crystal layer 630 and modulation electrode 650 of Figure 13.

[0026] Referring to Figures 1, 2, 3, and 13, the antenna device 10 further includes a modulation structure 600 disposed on the second portion 210-2 of the feed substrate 200. The modulation structure 600 includes a fourth substrate 610, a fifth substrate 620, a liquid crystal layer 630, and a fifth ground electrode 640. The liquid crystal layer 630 is disposed between the fourth substrate 610 and the fifth substrate 620. In some embodiments, the materials of the fourth substrate 610 and the fifth substrate 620 of the modulation structure 600 are different from the material of the third substrate 410 of the conductive substrate 400. In some embodiments, the materials of the fourth substrate 610 and the fifth substrate 620 of the modulation structure 600 include, for example, glass, but the present invention is not limited thereto.

[0027] One of the fourth substrate 610 and the fifth substrate 620 has an extension 622. The extension 622 extends beyond the area of ​​the other of the fourth substrate 610 and the fifth substrate 620. A fifth ground electrode 640 is disposed on one of the fourth substrate 610 and the fifth substrate 620, and is located between the liquid crystal layer 630 and one of the fourth substrate 610 and the fifth substrate 620. The fifth ground electrode 640 has an extension 642. The extension 642 of the fifth ground electrode 640 is disposed on the extension 622 of one of the fourth substrate 610 and the fifth substrate 620. The fourth ground electrode 420 of the conductive substrate 400 faces the extension 642 of the fifth ground electrode 640 of the modulation structure 600 and overlaps with the extension 642 of the fifth ground electrode 640 of the modulation structure 600. In some embodiments, the modulation structure 600 may further include a modulation electrode 650 disposed on the other of the fourth substrate 610 and the fifth substrate 620, and located between the other of the fourth substrate 610 and the fifth substrate 620 and the liquid crystal layer 630.

[0028] For example, in some embodiments, the fourth substrate 610 is located between the fifth substrate 620 and the feed substrate 200, the fifth ground electrode 640 is disposed on the fifth substrate 620 and located between the liquid crystal layer 630 and the fifth substrate 620, the modulation electrode 650 is disposed on the fourth substrate 610 and located between the fourth substrate 610 and the liquid crystal layer 630, the fifth substrate 620 has an extension 622 extending beyond the area of ​​the fourth substrate 610, the fifth ground electrode 640 has an extension 642, the extension 642 of the fifth ground electrode 640 is disposed on the extension 622 of the fifth substrate 620, and the fourth ground electrode 420 of the conductive substrate 400 is disposed below the extension 642 of the fifth ground electrode 640 of the modulation structure 600.

[0029] In some embodiments, an air gap g exists between the fourth ground electrode 420 of the conductive substrate 400 and the extension 642 of the fifth ground electrode 640 of the modulation structure 600. In some embodiments, the fourth ground electrode 420 of the conductive substrate 400 and the extension 642 of the fifth ground electrode 640 of the modulation structure 600 have a distance d in a direction z perpendicular to the third substrate 410 of the conductive substrate 400, and the distance d is, for example, in the range of 0.001 mm to 1 mm. However, the present invention is not limited thereto, and in other embodiments, the fourth ground electrode 420 of the conductive substrate 400 and the extension 642 of the fifth ground electrode 640 of the modulation structure 600 may also be in contact.

[0030] Referring to Figures 1, 2, and 3, a portion of the signal source line 120 near the signal source 160 and a portion of the ground electrode 140 are located in region I. Another portion of the signal source line 120 near the first ground electrode 130 and another portion of the ground electrode 140 are located in region II. A further portion 122 of the signal source line 120 adjacent to the first ground electrode 130, the first portion 210-1 of the feed substrate 200, and the fourth ground electrode 420 of the conductive substrate 400 are located in region III. The radiating conductive pattern 250 of the feed substrate 200 and the fifth ground electrode 640 of the modulation structure 600 are located in region IV.

[0031] Referring to Figures 1, 2, and 3, the stacked signal source substrate 100, feed substrate 2000, and conductive substrate 400 can achieve the effect of irregular cutting in the thickness direction (i.e., direction z). The stacked signal source substrate 100, feed substrate 2000, and conductive substrate 400 are assembled together in a face-to-face manner to transmit high-frequency electromagnetic wave signals. Specifically, in region I, the electromagnetic wave signal is transmitted in a microstrip manner; in regions II and III, the electromagnetic wave signal is transmitted in a co-plane waveguide with ground (CPWG) manner, thereby enabling the signal of the first ground electrode 130 of the signal source substrate 100 to be transmitted to the fifth ground electrode 640 of the modulation structure 600; in region IV, the electromagnetic wave signal is transmitted in a microstrip manner.

[0032] It is worth noting that the conductive substrate 400 can transmit electromagnetic wave signals to the fifth ground electrode 640 of the modulation structure 600 without the need for soldering. Therefore, there is no problem of soldering the conductive substrate 400 and the modulation structure 600. Furthermore, if the modulation structure 600 is damaged, the damaged modulation structure 600 can be easily removed from the second part 210-2 of the feed substrate 200 and replaced with a new modulation structure 600, while continuing to use the normal feed substrate 200, conductive substrate 400, and signal source substrate 100. In other words, the antenna device 10 is easy to repair and has low repair costs.

[0033] In some embodiments, the first component 510 of the bonding element 500 may be electrically connected to the first ground electrode 130 of the signal source substrate 100 and the fourth ground electrode 420 of the conductive substrate 400 to avoid generating other modes that affect the transmission efficiency during high-frequency transmission.

[0034] In some embodiments, the air gap g between the fourth ground electrode 420 of the conductive substrate 400 and the extension 642 of the fifth ground electrode 640 of the modulation structure 600 can achieve the effect of DC blocking, blocking the low-frequency signal of the driving modulation structure 600 from passing through, and reducing the interference of the low-frequency signal of the driving modulation structure 600.

[0035] It must be noted that the following embodiments use the component reference numerals and some content of the foregoing embodiments, wherein the same reference numerals are used to represent the same or similar components, and the description of the same technical content is omitted. For the description of the omitted parts, please refer to the foregoing embodiments, and the following embodiments will not repeat them.

[0036] Figure 14 is a cross-sectional schematic diagram of an antenna device according to another embodiment of the present invention. Figure 15 is a cross-sectional schematic diagram of an antenna device according to another embodiment of the present invention. Referring to Figures 14 and 15, the antenna device 10A includes a signal source substrate 100, a feed substrate 200, a conductive substrate 400A, a bonding element 500, and a modulation structure 600A. The signal source substrate 100 includes a first substrate 110, a signal source line 120, and a first ground electrode 130. The first substrate 110 has an upper surface 112. The signal source line 120 is disposed on the upper surface 112 of the first substrate 110. The first ground electrode 130 is disposed on the upper surface 112 of the first substrate 110 and is structurally separated from the signal source line 120. The feed substrate 200 is partially disposed on the signal source substrate 100. The feed substrate 200 includes a second substrate 210, a feed signal line 220, a second ground electrode 230, and a third ground electrode 240. The second substrate 210 has an opposing upper surface 212 and a lower surface 214. The lower surface 214 of the second substrate 210 of the feed substrate 200 faces the upper surface 112 of the first substrate 110 of the signal source substrate 100. The second substrate 210 has a first portion 210-1 and a second portion 210-2 connected to each other. The first portion 210-1 of the second substrate 210 is disposed on the signal source substrate 100. The second portion 210-2 of the second substrate 210 is disposed outside the area of ​​the signal source substrate 100. A feed signal line 220 is disposed on the lower surface 214 of the second substrate 210. A portion 222 of the feed signal line 220 of the feed substrate 200 is stacked on a portion 122 of the signal source line 120 of the signal source substrate 100. A second ground electrode 230 is disposed on the lower surface 214 of the second substrate 210 and is structurally separated from the feed signal line 220. A second ground electrode 230 of the feed substrate 200 is stacked on the first ground electrode 130 of the signal source substrate 100. A third ground electrode 240 is disposed on the upper surface 212 of the second substrate 210 and electrically connected to the second ground electrode 230. A conductive substrate 400A is disposed on the feed substrate 200. The conductive substrate 400A includes a third substrate 410 and a fourth ground electrode 420. The third substrate 410 has an upper surface 412 and a lower surface 414. The upper surface 412 of the third substrate 410 faces away from the upper surface 212 of the second substrate 210 of the feed substrate 200, and the lower surface 414 of the third substrate 410 faces the upper surface 212 of the second substrate 210 of the feed substrate 200. The fourth ground electrode 420A is disposed on one of the upper surface 412 and the lower surface 414 of the third substrate 410 and electrically connected to the third ground electrode 240 of the feed substrate 200. The bonding element 510 bonds the conductive substrate 400A, the feed substrate 200, and the signal source substrate 100. The modulation structure 600A is disposed on the second part 210-2 of the feed substrate 200.The modulation structure 600 includes a fourth substrate 610, a fifth substrate 620, a liquid crystal layer (not shown), and fifth ground electrodes 640 and 640A. The fourth substrate 610 is located between the fifth substrate 620 and the feed substrate 200. The liquid crystal layer (not shown) is disposed between the fourth substrate 610 and the fifth substrate 620. One of the fourth substrate 610 and the fifth substrate 620 has an extension 612. The extension 612 of one of the fourth substrate 610 and the fifth substrate 620 extends beyond the area of ​​the other of the fourth substrate 610 and the fifth substrate 620. The fifth ground electrode 640A is disposed on one of the fourth substrate 610 and the fifth substrate 620 and is located between the liquid crystal layer (not shown) and one of the fourth substrate 610 and the fifth substrate 620. The fifth ground electrode 640 has an extension 642. The extension 642 of the fifth ground electrode 640 is disposed on the extension 612 of one of the fourth substrate 610 and the fifth substrate 620. The fourth ground electrode 420 of the conductive substrate 400A faces the extension 642 of the fifth ground electrode 640A of the modulation structure 600 and overlaps with the extension 642 of the fifth ground electrode 640A of the modulation structure 600.

[0037] Unlike the aforementioned antenna device 10, in the antenna device 10A of FIG. 14 and FIG. 15, the fourth substrate 610 of the modulation structure 600A has an extension 612 extending beyond the area of ​​the fifth substrate 620, and the fifth ground electrode 640A is disposed on the fourth substrate 610. The extension 642 of the fifth ground electrode 640 is disposed on the extension 612 of the fourth substrate 610. The fourth ground electrode 420 of the conductive substrate 400A is the extension 642 of the fifth ground electrode 640A of the modulation structure 600A disposed on the lower surface 414 of the third substrate 410 and facing the fifth ground electrode 640A of the modulation structure 600A.

[0038] Furthermore, the antenna device 10A of Figures 14 and 15 further includes an intermediate substrate 300 disposed on a first portion 210-1 of the feed substrate 200. The intermediate substrate 300 includes a base 310. The base 310 has opposing upper surfaces 312 and lower surfaces 314. The lower surface 314 of the base 310 faces the upper surface 212 of the second base 210 of the feed substrate 200. The intermediate substrate 300 also includes a ground electrode 320 disposed on the lower surface 314 of the base 310. The ground electrode 320 of the intermediate substrate 300 is stacked on the third ground electrode 240 of the feed substrate 200. The ground electrode 320 of the intermediate substrate 300 and the third ground electrode 240 of the feed substrate 200 face each other and are in contact. In some embodiments, the ground electrode 320 of the intermediate substrate 300 and the third ground electrode 240 of the feed substrate 200 may abut against each other and be in contact with each other. The intermediate substrate 300 further includes a ground electrode 330 disposed on the upper surface 312 of the third substrate 310 and electrically connected to the ground electrode 320. In some embodiments, the intermediate substrate 300 further includes a conductive via 340 disposed in the substrate 310 and electrically connected to the ground electrode 320 and the ground electrode 330.

[0039] Figure 16 is a schematic diagram of a physiological signal detection system according to an embodiment of the present invention. The physiological signal detection system 1 includes the aforementioned antenna device 10 / 10A, a processing element 20 electrically connected to the antenna device 10 / 10A, and a response element 30 electrically connected to the processing element 20. The antenna device 10 / 10A of the physiological signal detection system 10 is used to emit electromagnetic waves EM toward the biological organism H to be tested and to receive electromagnetic waves EM' reflected by the biological organism H to be tested. After the electromagnetic waves EM emitted by the antenna device 10 / 10A are reflected by the biological organism H to be tested, they can be received by the antenna device 10 / 10A to obtain an electrical signal S1. The processing element 20 can provide a response signal S2 according to the electrical signal S1. The response element 30 can receive the response signal S2 and make a corresponding response.

[0040] For example, in some embodiments, the biological entity H to be tested is, for example, a human being, and the response element 30 is a screen and / or a speaker. When the electromagnetic wave EM emitted by the antenna device 10 / 10A is reflected by the human body, the reflected electromagnetic wave EM' can be received by the antenna device 10 / 10A, thereby obtaining an electrical signal S1. The processing element 20 can determine whether the human's physiological signals (e.g., heartbeat, breathing, etc.) are abnormal based on the electrical signal S1. If the processing element 20 determines that the physiological signal is abnormal, it will issue an abnormal response signal S2 to cause the screen and / or speaker to emit a warning signal (e.g., flashing lights and / or beeping sounds, etc.). In some embodiments, the physiological signal detection system 10 can be applied in medical settings such as hospitals, clinics, postpartum care centers, and long-term care institutions, but the present invention is not limited thereto. [Simplified Explanation of the Diagram]

[0041] Figure 1 is an exploded perspective view of an antenna device according to an embodiment of the present invention. Figure 2 is a cross-sectional view of an antenna device according to an embodiment of the present invention. Figure 3 is a cross-sectional view of an antenna device according to an embodiment of the present invention. Figure 4 is a top view and a perspective view of the signal source substrate of an antenna device according to an embodiment of the present invention. Figure 5 is a bottom view and a perspective view of the feed substrate and modulation structure of an antenna device according to an embodiment of the present invention. Figure 6 is a bottom view of the feed substrate of an antenna device according to an embodiment of the present invention. Figure 7 is a top view of the feed substrate of an antenna device according to an embodiment of the present invention. Figure 8 is a partial top view and enlarged view of the signal source substrate of an antenna device according to an embodiment of the present invention. Figure 9 is a partial bottom view and enlarged view of the feed substrate of an antenna device according to an embodiment of the present invention. Figure 10 is a partial top view and perspective enlarged view of an antenna device according to an embodiment of the present invention. Figure 11 is a bottom view of the conductive substrate of an antenna device according to an embodiment of the present invention. Figure 12 is a top view of the conductive substrate of an antenna device according to an embodiment of the present invention. Figure 13 is a cross-sectional view of the modulation structure of an antenna device according to an embodiment of the present invention. Figure 14 is a cross-sectional view of an antenna device according to another embodiment of the present invention. Figure 15 is a cross-sectional schematic diagram of an antenna device according to another embodiment of the present invention. Figure 16 is a schematic diagram of a physiological signal detection system according to an embodiment of the present invention.

Claims

1. An antenna device, comprising: A signal source substrate includes: a first substrate having an upper surface; a signal source line disposed on the upper surface of the first substrate; and a first ground electrode disposed on the upper surface of the first substrate and structurally separated from the signal source line; a feed substrate partially disposed on the signal source substrate, wherein the feed substrate includes: a second substrate having an opposing upper surface and a lower surface, wherein the lower surface of the second substrate of the feed substrate faces the upper surface of the first substrate of the signal source substrate, the second substrate having a first portion and a second portion connected to each other, the first portion of the second substrate being disposed on the signal source substrate, and the second portion of the second substrate being disposed outside the area of ​​the signal source substrate; and a feed signal line disposed on the lower surface of the second substrate, wherein a portion of the feed signal line of the feed substrate is stacked on a portion of the signal source line of the signal source substrate; A second ground electrode is disposed on the lower surface of the second substrate and structurally separated from the feed signal line, wherein the second ground electrode of the feed substrate is stacked on the first ground electrode of the signal source substrate; and a third ground electrode is disposed on the upper surface of the second substrate and electrically connected to the second ground electrode; a conductive substrate is disposed on the feed substrate, wherein the conductive substrate includes: a third substrate having an upper surface, wherein the upper surface of the third substrate faces away from the upper surface of the second substrate of the feed substrate; and a fourth ground electrode is disposed on the upper surface of the third substrate and electrically connected to the third ground electrode of the feed substrate; a bonding element bonding the conductive substrate, the feed substrate and the signal source substrate; and a modulation structure is disposed on the second portion of the feed substrate, wherein the modulation structure includes: a fourth substrate; and a fifth substrate, wherein the fourth substrate is located between the fifth substrate and the feed substrate; A liquid crystal layer is disposed between the fourth substrate and the fifth substrate; and a fifth ground electrode is disposed on the fifth substrate and located between the liquid crystal layer and the fifth substrate, wherein the fifth substrate has an extension extending beyond the area of ​​the fourth substrate, the fifth ground electrode has an extension, the extension of the fifth ground electrode is disposed on the extension of the fifth substrate, and the fourth ground electrode of the conductive substrate is disposed below the extension of the fifth ground electrode of the modulation structure.

2. The antenna device as claimed in claim 1, wherein the signal source substrate further includes a first conductive via, the first conductive via of the signal source substrate being disposed in the first substrate of the signal source substrate and electrically connected to the first ground electrode of the signal source substrate; the feed substrate further includes a second conductive via, the second conductive via of the feed substrate being disposed in the second substrate of the feed substrate and electrically connected to the second ground electrode and the third ground electrode of the feed substrate; the conductive substrate further includes a third conductive via, the third conductive via of the conductive substrate being disposed in the third substrate of the conductive substrate and electrically connected to the fourth ground electrode of the conductive substrate; the bonding element includes a first assembly disposed in the first conductive via of the signal source substrate, the second conductive via of the feed substrate, and the third conductive via of the conductive substrate.

3. The antenna device as claimed in claim 1, wherein an air gap exists between the fourth ground electrode of the conductive substrate and the extension of the fifth ground electrode of the modulation structure.

4. The antenna device as claimed in claim 1, wherein the fourth ground electrode of the conductive substrate and the extension of the fifth ground electrode of the modulation structure have a distance in a direction perpendicular to the third substrate of the conductive substrate, and the distance falls within the range of 0.001 mm to 1 mm.

5. The antenna apparatus as claimed in claim 1, wherein the line width of that portion of the feed signal line is greater than the line width of that portion of the signal source line.

6. The antenna device as claimed in claim 1, wherein a portion of the feed signal line is disposed on the first portion of the second substrate, another portion of the feed signal line is disposed on the second portion of the second substrate, the portion of the feed signal line is connected to the other portion of the feed signal line, and the line width of the other portion of the feed signal line is greater than the line width of the portion of the feed signal line.

7. The antenna device as claimed in claim 1, wherein the bonding element includes a first component and a second component, wherein the first component and the second component cooperate to securely stack the conductive substrate, the feed substrate and the signal source substrate together.

8. The antenna device as claimed in claim 7, wherein the first component and the second component are a screw and a nut, respectively.

9. An antenna device, comprising: A signal source substrate includes: a first substrate having an upper surface; a signal source line disposed on the upper surface of the first substrate; and a first ground electrode disposed on the upper surface of the first substrate and structurally separated from the signal source line; a feed substrate partially disposed on the signal source substrate, wherein the feed substrate includes: a second substrate having an opposing upper surface and a lower surface, wherein the lower surface of the second substrate of the feed substrate faces the upper surface of the first substrate of the signal source substrate, the second substrate having a first portion and a second portion connected to each other, the first portion of the second substrate being disposed on the signal source substrate, and the second portion of the second substrate being disposed outside the area of ​​the signal source substrate; and a feed signal line disposed on the lower surface of the second substrate, wherein a portion of the feed signal line of the feed substrate is stacked on a portion of the signal source line of the signal source substrate; A second ground electrode is disposed on the lower surface of the second substrate and structurally separated from the feed signal line, wherein the second ground electrode of the feed substrate is stacked on the first ground electrode of the signal source substrate; and a third ground electrode is disposed on the upper surface of the second substrate and electrically connected to the second ground electrode; a conductive substrate is disposed on the feed substrate, wherein the conductive substrate includes: a third substrate having an upper surface and a lower surface, wherein the upper surface of the third substrate faces away from the upper surface of the second substrate of the feed substrate, and the lower surface of the third substrate faces the upper surface of the second substrate of the feed substrate; and a fourth ground electrode is disposed on one of the upper surface and the lower surface of the third substrate and electrically connected to the third ground electrode of the feed substrate; a bonding element for bonding the conductive substrate, the feed substrate and the signal source substrate; and a modulation structure is disposed on the second portion of the feed substrate, wherein the modulation structure includes: A fourth substrate; a fifth substrate, wherein the fourth substrate is located between the fifth substrate and the feed substrate; a liquid crystal layer disposed between the fourth substrate and the fifth substrate; and a fifth ground electrode, wherein one of the fourth substrate and the fifth substrate has an extension portion extending beyond the area of ​​the other of the fourth substrate and the fifth substrate, the fifth ground electrode is disposed on the fourth substrate and the fifth substrate and located between the liquid crystal layer and the fourth substrate and the fifth substrate, the fifth ground electrode has an extension portion disposed on the extension portion of the fourth substrate and the fifth substrate, the fourth ground electrode of the conductive substrate faces the extension portion of the fifth ground electrode of the modulation structure and overlaps with the extension portion of the fifth ground electrode of the modulation structure.

10. A physiological signal detection system, comprising: The antenna device as described in claim 9; A processing element is electrically connected to the antenna device; And a response element electrically connected to the processing element.

Images