Encapsulated Antenna Based on End-Fire Subarray Decomposition

Abstract

A packaged antenna based on end-fire radiating subarray decomposition is disclosed, comprising: an antenna array, multiple carrier plates, multiple isolators, and multiple radio frequency (RF) chips. The antenna array includes multiple polarized antenna subarrays, each of which is disposed on a composite dielectric substrate. One side of each carrier plate is bonded to the composite dielectric substrate. Multiple isolators are disposed between the carrier plates, so that the carrier plates are stacked with a gap between them. Multiple RF chips are respectively disposed on the carrier plates, and each RF chip is electrically connected to the polarized antenna subarray. One side of the carrier plate relative to the antenna array can be disposed on a circuit board, so that the direction of electromagnetic wave radiated by the antenna array is perpendicular to the surface of the circuit board.

Description

[Technical Field]

[0001] This invention relates to a packaged antenna, and more particularly to a packaged antenna based on end-fire radiating subarray decomposition, which can be used in wide-side radiating arrays at sub-terahertz frequencies. [Previous Technology]

[0002] The sub-terahertz (Sub-THz) frequency (250-310 GHz) has become the application band for sixth-generation (6G) mobile communications due to its wide bandwidth and ability to provide high data rates. However, due to the short wavelength characteristics of the sub-terahertz band, the propagation range of electromagnetic (EM) waves in this band is limited, and severe propagation losses occur within the dielectric substrate of its radio frequency (RF) system, limiting the efficiency of the RF system. To expand coverage, large phased-array antenna arrays are needed to enhance radiation gain and quickly guide narrow beams to the desired direction. These large phased-array antenna arrays must be combined with active RF transceiver modules to achieve this beam steering function. However, the extremely short wavelength of the sub-terahertz frequency means that the size of the RF transceiver module is much larger than the antenna size, posing a significant challenge to the implementation of large antenna arrays.

[0003] Antenna-in-Package (AiP) effectively reduces power loss within the dielectric substrate through its integration with the RF transceiver design. However, the issue of basic space for high-performance RF modules remains to be addressed. Previous technologies, when integrating a broad-side radiating antenna with a chip, required separating the two to prevent the antenna's radiation pattern from being affected by the chip. In high-frequency applications, this separation caused significant signal loss. The main objective of this invention is to solve the various problems associated with sub-terahertz frequency antenna-in-package technology. [Summary of the Invention]

[0004] To achieve the above objectives, the present invention provides a packaged antenna based on end-fire radiating subarray decomposition, comprising: an antenna array, multiple carrier plates, multiple isolators, and multiple radio frequency chips. The antenna array includes multiple polarized antenna subarrays, each polarized antenna subarray being disposed on a composite dielectric substrate. One side of each carrier plate is bonded to the composite dielectric substrate. Multiple isolators are disposed between the carrier plates, such that the carrier plates are stacked with a gap between them. Multiple radio frequency chips are respectively disposed on the carrier plates, and each radio frequency chip is electrically connected to the polarized antenna subarray. One side of the carrier plate relative to the antenna array can be disposed on a circuit board, such that the direction of electromagnetic wave radiated by the antenna array is perpendicular to the surface of the circuit board.

[0005] In one embodiment, the polarized antenna subarray includes a plurality of horizontally polarized antenna elements and a plurality of vertically polarized antenna elements, and the composite dielectric substrate includes a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein the second dielectric layer is located between the first dielectric layer and the third dielectric layer.

[0006] In one embodiment, the horizontally polarized antenna element includes: a grounded coplanar waveguide, a first bowtie antenna, a stripline, a hook-shaped feed line, a signal via, and a second bowtie antenna. The first bowtie antenna is disposed on the first dielectric layer, the stripline and the hook-shaped feed line are disposed on the second dielectric layer, the signal via is connected to the grounded coplanar waveguide and passes through the first dielectric layer, and the two ends of the stripline are respectively connected to the hook-shaped feed line and the signal via; the second bowtie antenna is disposed on the third dielectric layer.

[0007] In one embodiment, the grounded coplanar waveguide includes: a first metal layer, a signal line, a second metal layer, a third metal layer, and two isolation via walls; the first metal layer and the signal line are disposed on the first dielectric layer, the first metal layer has a signal line slot and a first feed slot, the signal line is disposed in the signal line slot and connected to the signal via, and a first bowtie antenna is located on both sides of the opening of the first feed slot and connected to the first metal layer; the second metal layer is sandwiched between the first dielectric layer and the second dielectric layer; the third metal layer is sandwiched between the second dielectric layer and the third dielectric layer, the third metal layer has a second feed slot, and a second bowtie antenna is located on both sides of the opening of the second feed slot and connected to the third metal layer; the two isolation via walls are disposed on the second metal layer and include a plurality of isolation vias, one end of the isolation vias passes through the first dielectric layer and is connected to the first metal layer, and the other end of the isolation vias passes through the second dielectric layer and is connected to the third metal layer.

[0008] In one embodiment, the vertically polarized antenna unit includes: a substrate integrated waveguide, two first magnetoelectric monopole antennas and two second magnetoelectric monopole antennas. The two first magnetoelectric monopole antennas are sandwiched between the second dielectric layer and the third dielectric layer and connected to the substrate integrated waveguide. The two second magnetoelectric monopole antennas are disposed on the surface of the third dielectric layer relative to the two first magnetoelectric monopole antennas. The two second magnetoelectric monopole antennas have connecting posts that pass through the third dielectric layer and connect to the first magnetoelectric monopole antennas.

[0009] In one embodiment, the substrate-integrated waveguide includes a first metal layer, a microstrip line, a second metal layer, a third metal, two isolation via walls, a fourth metal layer, and a reflective via wall. The first metal layer and the microstrip line are disposed on the first dielectric layer, and the microstrip line is connected to the first metal layer. The second metal layer is sandwiched between the first dielectric layer and the second dielectric layer. The two isolation via walls are disposed on the second metal layer and include a plurality of isolation vias. One end of the isolation via passes through the first dielectric layer and is connected to the first metal layer, and the other end of the isolation via passes through the second dielectric layer and is connected to the third metal layer. The third metal layer is sandwiched between the second dielectric layer and the third dielectric layer, and two first magnetoelectric monopole antennas are connected to the third metal layer. The fourth metal layer is disposed on the surface of the third dielectric layer relative to the third metal. The reflective via wall is disposed on the fourth metal layer and includes a plurality of reflective vias. One end of the reflective via passes through the third dielectric layer and is connected to the third metal layer.

[0010] In one embodiment, the horizontally polarized antenna elements and the vertically polarized antenna elements of the antenna array are arranged alternately, and adjacent horizontally polarized antenna elements and vertically polarized antenna elements in the polarized antenna subarray share the isolation via wall.

[0011] In one embodiment, the horizontally polarized antenna elements in the above-mentioned polarized antenna subarray are arranged in a mirror image.

[0012] In one embodiment, the isolation element is a virtual wafer or a solder ball.

[0013] In one embodiment, the frequency range of the electromagnetic waves radiated by the antenna array is between 250-310 GHz.

[0014] The packaged antenna based on end-fire radiating subarray decomposition of the present invention includes a complex polarized antenna subarray disposed on a composite dielectric substrate. The polarized antenna subarray is designed to end-fire along the side of the dielectric substrate, thereby creating an application space behind the antenna array. One side of the carrier plate is joined to the composite dielectric substrate. Isolators are disposed between the carrier plates, so that the carrier plates are stacked with a gap between them, allowing the radio frequency chip to be disposed on the carrier plate. The isolators can improve the heat dissipation efficiency of the chip. Each radio frequency chip is electrically connected to the polarized antenna subarray. The packaged antenna can be rotated 90 degrees, with the side of the carrier plate relative to the antenna array disposed on the circuit board, so that the direction of the electromagnetic wave radiated by the antenna array is perpendicular to the surface of the circuit board. The bilinear polarization of the antenna array can be aligned with the base station antenna for polarization matching. Accordingly, the various problems of size and signal loss of existing wide-side radiating antennas applied to subterahertz frequencies are effectively solved.

Implementation Method

[0015] The embodiments of the present invention will be described in more detail below with reference to the drawings and component symbols, so that those skilled in the art to which the present invention pertains can implement the present invention after reading this specification.

[0016] Figure 1 is a side perspective view of a packaged antenna based on end-fire radiating subarray decomposition according to an embodiment of the present invention. As shown in Figure 1, the packaged antenna 1 based on end-fire radiating subarray decomposition includes: an antenna array 11, a plurality of carrier plates 12, a plurality of isolators 13, and a plurality of radio frequency chips 14. The antenna array 11 includes a plurality of polarized antenna subarrays 111, each polarized antenna subarray 111 being disposed on a composite dielectric substrate 112; one side of each carrier plate 12 is bonded to the composite dielectric substrate 112; isolators 13 are disposed between the carrier plates 12, so that the carrier plates 12 are stacked with a gap between them; radio frequency chips 14 are respectively disposed on the carrier plates 12, and each radio frequency chip 14 is electrically connected to the polarized antenna subarray 111; one side of the carrier plate 12 relative to the antenna array 11 can be disposed on a circuit board 2, so that the direction of electromagnetic wave radiated by the antenna array 11 is perpendicular to the surface of the circuit board 2.

[0017] In this invention, the two-dimensional antenna array 11 is decomposed into a complex one-dimensional (1-D) polarized antenna subarray 111 implemented on a composite dielectric substrate 112. The polarized antenna subarray 111 is designed to radiate electromagnetic signals (end-emitting) along one side of the composite dielectric substrate 112. This layout provides sufficient space for the carrier plate 12 to accommodate the active RF chip 14. Then, multiple composite dielectric substrates 112 with polarized antenna subarrays 111 are vertically stacked to form the two-dimensional antenna array 11 using adhesive insulating materials (e.g., virtual wafers or low-temperature soldered ball grid arrays). The spacing between adjacent carrier plates 12 can construct the RF signal path during the packaged antenna operation. After stacking to form the two-dimensional antenna array 11, the entire packaged antenna is rotated 90 degrees, thereby converting end-emitting radiation into wide-side radiation, as desired by conventional packaged antennas. The packaged antenna of this invention has bilinear polarized radiation and can be aligned with a base station antenna for polarization matching.

[0018] FIG2 is a perspective view of a polarized antenna subarray according to an embodiment of the present invention. As shown in FIG2, the polarized antenna subarray 111 includes a plurality of horizontally polarized antenna elements 111H and a plurality of vertically polarized antenna elements 111V, and the composite dielectric substrate 112 includes a first dielectric layer 1121, a second dielectric layer 1122 and a third dielectric layer 1123, wherein the second dielectric layer 1122 is located between the first dielectric layer 1121 and the third dielectric layer 1123.

[0019] The composite dielectric substrate can be made of existing dielectric materials. In this embodiment, the thickness of the first dielectric layer 1121 and the third dielectric layer 1123 is 20 micrometers, and the thickness of the second dielectric layer 1122 is 60 micrometers. The dielectric constant (εr) of the first dielectric layer 1121, the second dielectric layer 1122, and the third dielectric layer 1123 is, for example, but not limited to, 3.6. The composite dielectric substrate 112 may further include two solder masks 1124 (as shown in Figures 3A and 3B), which are respectively disposed above the first dielectric layer 1121 and below the third dielectric layer 1123.

[0020] Figure 3A is a side perspective view of a horizontally polarized antenna element according to an embodiment of the present invention, and Figure 3B is an exploded view of a horizontally polarized antenna element according to an embodiment of the present invention. To clearly show the components of the horizontally polarized antenna element, the composite dielectric substrate in Figures 3A and 3B is represented by virtual lines (dotted chain lines). As shown in Figures 3A and 3B, each horizontally polarized antenna element 111H includes: a grounded co-planar waveguide (GCPW) 111H1, a first bowtie antenna 111H2, a stripe line 111H3, and a hook-like feeding line. The first bowtie antenna 111H2 is disposed on the first dielectric layer 1121, the stripline 111H3 and the hook-shaped feed line 111H4 are disposed on the second dielectric layer 1122, the signal via 111H5 is connected to the ground coplanar waveguide 111H1 and passes through the first dielectric layer 1121, and the two ends of the stripline 111H3 are respectively connected to the hook-shaped feed line 111H4 and the signal via 111H5; the second bowtie antenna 111H6 is disposed on the third dielectric layer 1123.

[0021] The grounded coplanar waveguide 111H1 includes: a first metal layer M1, a signal line S1 (50Ω), a second metal layer M2, a third metal layer M3, and two isolation via walls V1; the first metal layer M1 and the signal line S1 are disposed on the first dielectric layer 1121, and the first metal layer M1 has a signal line slot M11 and a first feed slot. Slot M12, signal line S1 is disposed in signal line slot M11 and connected to signal via 111H5, first bowtie antenna 111H2 is located on both sides of the opening of the first feed slot M12 and connected to the first metal layer M1; second metal layer M2 is sandwiched between the first dielectric layer 1121 and the second dielectric layer 1122; third metal layer M3 is sandwiched between the second dielectric layer 1122 and the third dielectric layer 1123, the third metal layer M3 has a second feed slot M31, second bowtie antenna 111H6 is located on both sides of the opening of the second feed slot M31 and connected to the third metal layer M3; two isolation via walls V1 are provided for the second metal layer M2, including a plurality of isolation vias V11, one end of the isolation via V11 passes through the first dielectric layer 1121 and is connected to the first metal layer M1, and the other end of the isolation via V11 passes through the second dielectric layer 1122 and is connected to the third metal layer M3.

[0022] A coplanar waveguide has a central conductor strip fabricated on one side of a dielectric substrate, and conductor planes fabricated on both sides adjacent to the central conductor strip. A grounded coplanar waveguide is a common variant of the coplanar waveguide, in which a grounded conductor plane is further covered on the back of the dielectric substrate. When electromagnetic waves propagate on a coplanar waveguide, part of the wave propagates on the dielectric substrate (between the metal planes), and the other part propagates in the air. A via is a current-carrying hole that penetrates the upper and lower surfaces of a substrate. The via wall has a conductive metal (mainly copper) and is used to connect circuits on the upper and lower layers of the dielectric substrate.

[0023] In this embodiment, the second metal layer M2 serves as the ground plane. The current is transmitted from the signal line S1 through the signal via 111H5 and the stripline 111H3 to the hook-shaped feed line 111H4. The hook-shaped feed line 111H4 transforms the current to different positions, thereby exciting the first bowtie antenna 111H2 and the second bowtie antenna 111H6. The size of the first bowtie antenna 111H2 is larger than the size of the second bowtie antenna 111H6, thereby generating two different radiation waveforms. The resonance and radiation characteristics of the horizontally polarized antenna element 111H were simulated and analyzed. The bowtie dipole antenna can produce a wider bandwidth than the triangular or rectangular dipole antenna. The arm length and feed slot width of the bowtie dipole antenna are key parameters affecting the reflection coefficient resonance. The larger first bowtie antenna 111H2 affects low-frequency performance, which can extend the frequency range to lower frequencies and increase the resonance depth. The smaller second bowtie antenna 111H6 affects high-frequency performance. When the feed slot width is reduced, the overall bandwidth becomes wider, but it may lead to bandwidth discontinuity and a decrease in overall gain.

[0024] The geometric parameters of the horizontally polarized antenna element 111H are related to the frequency range in which it is applied. For example, but not limited to, the geometric parameters of the horizontally polarized antenna element 111H applied to the sub-terahertz frequency range include: an arm length of 120 micrometers for the first bowtie antenna 111H2, a width of 40 micrometers for the stripline 111H3, a width of 30 micrometers for the hook-shaped feed line 111H4, a diameter of 60 micrometers for the signal via 111H5, and an arm length of... The thickness of the first metal layer M1 is 20 micrometers, the width of the signal line S1 is 30 micrometers, the thickness of the second metal layer M2 and the third metal layer M3 are both 22 micrometers, the width and length of the first feed trench M12 are 40 micrometers and 181 micrometers respectively, the width and length of the second feed trench M31 are 25 micrometers and 161 micrometers respectively, and the apertures of the isolation via V11 through the first dielectric layer 1121 and the second dielectric layer 1122 are 60 micrometers and 80 micrometers respectively.

[0025] Figure 4A is a side perspective view of a vertically polarized antenna element according to an embodiment of the present invention, and Figure 4B is an exploded view of a vertically polarized antenna element according to an embodiment of the present invention. To clearly illustrate the components of the vertically polarized antenna unit, the composite dielectric substrate in Figures 4A and 4B is represented by a virtual line (dotted chain line). As shown in Figures 4A and 4B, the vertically polarized antenna unit 111V includes: a substrate integrated waveguide (SIW) 111V1, two first magnetoelectric monopole antennas 111V2 and two second magnetoelectric monopole antennas 111V3. The first magnetoelectric monopole antennas 111V2 are sandwiched between the second dielectric layer 1122 and the third dielectric layer 1123 and connected to the substrate integrated waveguide. The second magnetoelectric monopole antennas 111V3 are disposed on the surface of the third dielectric layer 1123 relative to the first magnetoelectric monopole antennas 111V2. The second magnetoelectric monopole antennas 111V3 have connecting posts that pass through the third dielectric layer 1123 and connect to the first magnetoelectric monopole antennas 111V2.

[0026] The substrate-integrated waveguide 111V1 includes a first metal layer M1, a microstrip line S2 (50Ω), a second metal layer M2, a third metal layer M3, two isolation via walls V1, a fourth metal layer M4, and a reflective via wall V2. The first metal layer M1 and the microstrip line S2 are disposed on the first dielectric layer 1121, and the microstrip line S2 is connected to the first metal layer M1. The second metal layer M2 is sandwiched between the first dielectric layer 1121 and the second dielectric layer 1122. The two isolation via walls V1 are disposed on the second metal layer M2 and include a plurality of isolation vias V11. One end of the isolation via V11 passes through the first dielectric layer 1121 and is connected to the first metal layer. M1, the other end of the isolation via V11 passes through the second dielectric layer 1122 and connects to the third metal layer M3; the third metal layer M3 is sandwiched between the second dielectric layer 1122 and the third dielectric layer 1123, and the two first magnetoelectric monopole antennas 111V2 are connected to the third metal layer M3; the fourth metal layer M4 is disposed on the surface of the third dielectric layer 1123 relative to the third metal M3, and the reflective via wall V2 is disposed on the fourth metal layer M4, including a plurality of reflective vias V21, one end of the reflective via V21 passes through the third dielectric layer 1123 and connects to the third metal layer M3.

[0027] The circuit of the substrate-integrated waveguide occupies an important position in the millimeter wave field. It has the characteristics of low transmission loss like a waveguide. By setting a row of metal vias (via walls) on the sides of the metal dielectric on the top and bottom surfaces of the printed circuit board (PCB), when the spacing of the metal vias is small enough and can form a waveguide structure with the same rectangular dielectric, the energy of electromagnetic waves is concentrated in the waveguide structure and propagated, and integrated with the substrate circuit of the PCB.

[0028] In this embodiment, the current is generated by the microstrip line S2 for excitation. The second metal layer M2 and the fourth metal layer M4 serve as pads for the isolation via V11 and the reflection via V21, forming the isolation via wall V1 and the reflection via wall V2. The second metal layer M2 and the fourth metal layer M4 have opposite U-shapes. The third metal layer M3 serves as the ground plane, with its front end contacting the first magnetoelectric monopole antenna 111V2. The first metal layer M1 partially covers the top of the first magnetoelectric monopole antenna 111V2. The fourth metal layer M4 does not contact the second magnetoelectric monopole antenna 111V3; both the first magnetoelectric monopole antenna 111V2 and the second magnetoelectric monopole antenna 111V3 are disk-shaped, and the diameter of the second magnetoelectric monopole antenna 111V3 is slightly larger than the diameter of the first magnetoelectric monopole antenna 111V2. The connected first magnetoelectric monopole antenna 111V2 and the second magnetoelectric monopole antenna 111V3 form a magnetoelectric dipole antenna. The magnetoelectric dipole antenna has the characteristics of large bandwidth, symmetrical direction, low back lobe and stable gain.

[0029] The geometric parameters of the vertically polarized antenna element 111V applied in the subterahertz frequency range are, for example but not limited to: the width of the microstrip line S2 is 30 micrometers, the diameter of the first magnetoelectric monopole antenna 111V2 is 156 micrometers, and the diameter of the second magnetoelectric monopole antenna 111V3 is 194 micrometers.

[0030] Figure 5 is a top view of the subarray of an antenna array according to an embodiment of the present invention. As shown in Figure 5, the antenna array 11 includes four layers of polarized antenna subarrays 111. Each layer of polarized antenna subarray 111 includes four horizontally polarized antenna elements 111H and four vertically polarized antenna elements 111V. The horizontally polarized antenna elements 111H and vertically polarized antenna elements 111V in the same layer and in the upper and lower layers of the antenna array 11 are arranged alternately. A set of horizontally polarized antenna elements 111H and vertically polarized antenna elements 111V is used as an array element. The polarized antenna subarray 111 is a 1×4 (array element) one-dimensional array, and the antenna array 11 is a 4×4 (array element) two-dimensional array. In order to form a compact and thin structure, adjacent horizontally polarized antenna elements 111H and vertically polarized antenna elements 111V in each polarized antenna subarray 111 share an isolation via wall V1. The distance between adjacent horizontally polarized antenna elements 111H or vertically polarized antennas 111V is, for example, but not limited to, 930 micrometers; the overall size of the polarized antenna subarray 111 is, for example, but not limited to, 1536 × 3876 × 224 cubic micrometers; and the overall size of the antenna array 11 is, for example, but not limited to, 1536 × 3876 × 1796 cubic micrometers.

[0031] It is worth noting that the radiation performance is highly dependent on the antenna structure and is easily affected by the cross-polarization (X-pol) component. By mirroring the horizontal polarization antenna elements 111H in each polarization antenna subarray 111, antenna radiation with opposite signs in the coaxial direction can be generated. The additional 180-degree phase is applied to the imaging phase to align the coplanar polarization (Co-pol) radiation phase and cancel it out with the cross-polarization (X-pol) radiation phase. Furthermore, the polarization antenna subarray 111 may radiate grating lobes due to the excessively large element period of the horizontal polarization antenna elements 111H and the vertical polarization antenna elements 111V. By exchanging the order of the horizontal polarization antenna elements 111H and the vertical polarization antenna elements 111V in different layers of polarization antenna subarrays 111, the equivalent period can be reduced and the grating lobes can be suppressed.

[0032] Full-wave simulation of the antenna array in the above embodiments was performed using HFSS to verify the gain and efficiency of the antenna array in the above embodiments. Figure 6 is a gain and efficiency diagram of an antenna array according to an embodiment of the present invention. As shown in Figure 6, for the 4×4 two-dimensional antenna array in the above embodiments, for horizontal polarization (H-pol), the maximum gain is 17.2 dBi at a frequency of 250 GHz, the 3dB gain bandwidth exceeds 50 GHz, and the highest efficiency of 75.6% is achieved at a frequency of 269 GHz; for vertical polarization (V-pol), the gain exceeds 15 dBi at frequencies below 260 GHz, the maximum gain is 17.4 dBi at a frequency of 288 GHz, the 3dB gain bandwidth is approximately 54 GHz, and the highest efficiency of 78.2% is achieved at a frequency of 300 GHz. The verification results show that the antenna array in the above embodiments can meet the application requirements of subterahertz frequencies.

[0033] In summary, the packaged antenna based on end-fire radiating subarray decomposition of the present invention includes a complex polarized antenna subarray disposed on a composite dielectric substrate. The polarized antenna subarray is designed to end-fire along the side of the dielectric substrate, thereby creating an application space behind the antenna array. One side of the carrier plate is joined to the composite dielectric substrate. Isolators are disposed between the carrier plates, so that the carrier plates are stacked with a gap between them, allowing the radio frequency chip to be disposed on the carrier plate. The isolators can improve the heat dissipation efficiency of the chip. Each radio frequency chip is electrically connected to the polarized antenna subarray. The packaged antenna can be rotated 90 degrees, with the side of the carrier plate relative to the antenna array disposed on the circuit board, so that the direction of the electromagnetic wave radiated by the antenna array is perpendicular to the surface of the circuit board. The bilinear polarization of the antenna array can be aligned with the base station antenna for polarization matching. Accordingly, the various problems of size and signal loss of existing wide-side radiating antennas applied to subterahertz frequencies are effectively solved.

[0034] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Any person skilled in the art can modify, combine, and alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications, combinations, or alterations made by those skilled in the art without departing from the spirit and technical principles disclosed in the present invention should still be covered by the scope of the patent applications of this invention. [Simplified Explanation of the Diagram]

[0035] Figure 1 is a side perspective view of an encapsulated antenna based on end-fire radiating subarray decomposition according to an embodiment of the present invention; Figure 2 is a three-dimensional perspective view of a polarized antenna subarray according to an embodiment of the present invention; Figure 3A is a side perspective view of a horizontally polarized antenna element according to an embodiment of the present invention, and Figure 3B is an exploded view of a horizontally polarized antenna element according to an embodiment of the present invention; Figure 4A is a side perspective view of a vertically polarized antenna element according to an embodiment of the present invention, and Figure 4B is an exploded view of a vertically polarized antenna element according to an embodiment of the present invention; Figure 5 is a top view of the subarray decomposition of an antenna array according to an embodiment of the present invention; and Figure 6 is a gain and efficiency diagram of an antenna array according to an embodiment of the present invention.

Claims

1. A packaged antenna based on end-fire radiating subarray decomposition, comprising: An antenna array, comprising a plurality of complex polarized antenna subarrays, each of the polarized antenna subarrays being disposed on a composite dielectric substrate; A plurality of carrier plates, each carrier plate having one side of which is bonded to the composite dielectric substrate; a plurality of spacers disposed between the carrier plates, such that the carrier plates are stacked with a gap between them; a plurality of radio frequency chips disposed on the carrier plates, each radio frequency chip being electrically connected to the polarized antenna subarray; and the carrier plates being disposed on one side of the antenna array relative to the antenna array on a circuit board, such that the direction of electromagnetic wave radiation by the antenna array is perpendicular to the surface of the circuit board.

2. The packaged antenna based on end-fire radiating subarray decomposition as described in claim 1, wherein each of the polarized antenna subarrays includes a complex number of horizontally polarized antenna elements and a complex number of vertically polarized antenna elements, and the composite dielectric substrate includes a first dielectric layer, a second dielectric layer and a third dielectric layer, wherein the second dielectric layer is located between the first dielectric layer and the third dielectric layer.

3. The packaged antenna based on end-fire radiating subarray decomposition as described in claim 2, wherein each of the horizontally polarized antenna elements comprises: The device comprises a grounded coplanar waveguide, a first bowtie antenna, a stripline, a hook-shaped feed line, a signal via, and a second bowtie antenna. The first bowtie antenna is disposed on the first dielectric layer, the stripline and the hook-shaped feed line are disposed on the second dielectric layer, the signal via connects to the grounded coplanar waveguide and passes through the first dielectric layer, and the two ends of the stripline are respectively connected to the hook-shaped feed line and the signal via; the second bowtie antenna is disposed on the third dielectric layer.

4. The packaged antenna based on end-fire radiating subarray decomposition as described in claim 3, wherein the grounded coplanar waveguide comprises: The system comprises a first metal layer, a signal line, a second metal layer, a third metal layer, and two isolation via walls. The first metal layer and the signal line are disposed on the first dielectric layer. The first metal layer has a signal line slot and a first feed slot. The signal line is disposed in the signal line slot and connected to the signal via. A first bowtie antenna is located on both sides of the opening of the first feed slot and connected to the first metal layer. The second metal layer is sandwiched between the first dielectric layer and the second dielectric layer. The third metal layer is sandwiched between the second dielectric layer and the third dielectric layer. The third metal layer has a second feed slot. The second bowtie antenna is located on both sides of the opening of the second feed slot and connected to the third metal layer. The two isolation via walls are disposed on the second metal layer and include a plurality of isolation vias. One end of each isolation via passes through the first dielectric layer and is connected to the first metal layer, and the other end of each isolation via passes through the second dielectric layer and is connected to the third metal layer.

5. The packaged antenna based on end-fire radiating subarray decomposition as described in claim 2, wherein each of the vertically polarized antenna elements comprises: A substrate integrates a waveguide, two first magnetoelectric monopole antennas, and two second magnetoelectric monopole antennas. The two first magnetoelectric monopole antennas are sandwiched between a second dielectric layer and a third dielectric layer and connected to the substrate integrated waveguide. The two second magnetoelectric monopole antennas are disposed on the surface of the third dielectric layer relative to the two first magnetoelectric monopole antennas. The two second magnetoelectric monopole antennas have connecting posts that pass through the third dielectric layer and connect to the first magnetoelectric monopole antennas.

6. The packaged antenna based on end-fire radiating subarray decomposition as described in claim 5, wherein the substrate integrated waveguide includes a first metal layer, a microstrip line, a second metal layer, a third metal layer, two isolation via walls, a fourth metal layer, and a reflective via wall; the first metal layer and the microstrip line are disposed on the first dielectric layer, and the microstrip line is connected to the first metal layer; the second metal layer is sandwiched between the first dielectric layer and the second dielectric layer; the two isolation via walls are disposed on the second metal layer and include a plurality of isolation vias; the isolation vias... One end of the via passes through the first dielectric layer and connects to the first metal layer, and the other end of the isolating via passes through the second dielectric layer and connects to the third metal layer; the third metal layer is sandwiched between the second dielectric layer and the third dielectric layer, and the two first magnetoelectric monopole antennas are connected to the third metal layer; the fourth metal layer is disposed on the surface of the third dielectric layer relative to the third metal layer, and the reflective via wall is disposed on the fourth metal layer, including a plurality of reflective vias, one end of which passes through the third dielectric layer and connects to the third metal layer.

7. The packaged antenna based on end-fire radiating subarray decomposition as described in claim 4 or 6, wherein the horizontally polarized antenna elements and the vertically polarized antenna elements of the antenna array are arranged alternately, and adjacent horizontally polarized antenna elements and vertically polarized antenna elements in each polarized antenna subarray share the isolation via wall.

8. The packaged antenna based on end-fire radiating subarray decomposition as described in claim 2, wherein the horizontally polarized antenna elements in each polarized antenna subarray are arranged in a mirror image.

9. The packaged antenna based on end-fire radiating subarray decomposition as described in claim 1, wherein the isolators are virtual wafers or solder balls.

10. The packaged antenna based on end-fire radiating subarray decomposition as described in claim 1, wherein the frequency range of the electromagnetic waves radiated by the antenna array is between 250 and 310 GHz.

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