Device topologies for electro-photonic integrated circuits comprising transmitters and receivers

TW202638603APending Publication Date: 2026-09-16ELECTROPHOTONIC IC INC
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114148619
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-12-11
Filing Date
2025-12-11
Publication Date
2026-09-16

Smart Images

  • Figure TWG2TA001076708_001
    Figure TWG2TA001076708_001
  • Figure TWG2TA001076708_002
    Figure TWG2TA001076708_002
  • Figure TWG2TA001076708_003
    Figure TWG2TA001076708_003
Patent Text Reader

Abstract

This invention discloses a device topology for a monolithic electro-optic integrated circuit comprising optical transmitters and receivers, wherein each transmitter includes a first electroabsorption modulator (EAM) waveguide and EAM driving electronics, and each receiver includes a waveguide photodiode (which may be a second EAM waveguide) and a transimpedance amplifier (TIA); and optical input ports for coupling external lasers to each transmitter, or on-chip lasers. Compared to discrete electronics, monolithic integration of photonic devices and electronics on a single chip with a compact form factor provides reduced interconnection paths between the EAM and electronics. Tx optical output ports and Rx optical input ports may be staggered or arranged along the first edge (front edge) of the chip with a port pitch of ≤350µm. The epitaxial layer structure may be fabricated from InP-based materials, providing an electronic layer comprising InP HBTs and an overlay photonic layer providing the first and second EAM waveguides.
Need to check novelty before this filing date? Find Prior Art