Wiring circuit board

TW202638684APending Publication Date: 2026-09-16NITTO DENKO CORP
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Patent Information

Application Number
TW114141413
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-11-21
Filing Date
2025-10-27
Publication Date
2026-09-16

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  • Figure TWG2TA001076354_001
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    Figure TWG2TA001076354_003
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Abstract

The wiring circuit board 1 of the present invention has a first portion 1A, a second portion 1B, and a connection portion 1C connecting the first portion 1A and the second portion 1B. Furthermore, the wiring circuit board 1 includes a metal layer 11, a first insulating layer 12, a first circuit pattern 13, a second circuit pattern 14, and a third circuit pattern 15. The metal layer 11 is continuously disposed on the first portion 1A, the second portion 1B, and the connection portion 1C. The first circuit pattern 13 is electrically connected to the metal layer 11 of the first portion 1A. The second circuit pattern 14 is electrically connected to the metal layer 11 of the second portion 1B. The third circuit pattern 15 electrically connects the metal layer 11 of the first portion 1A and the metal layer 11 of the second portion 1B.
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