Molded articles, wiring boards, manufacturing methods for molded articles, and manufacturing methods for wiring boards

TW202638685APending Publication Date: 2026-09-16FUJIKURA LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114150684
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-11
Filing Date
2025-12-23
Publication Date
2026-09-16

Smart Images

  • Figure TWG2TA001076899_001
    Figure TWG2TA001076899_001
  • Figure TWG2TA001076899_002
    Figure TWG2TA001076899_002
  • Figure TWG2TA001076899_003
    Figure TWG2TA001076899_003
Patent Text Reader

Abstract

Issue: To provide a molded article that allows for greater design freedom. Solution: The molded article 10 includes: a film-like substrate 30 and a wiring layer 50 held on the substrate 30. The substrate 30 includes: a pair of molded portions 31A and 31B with a convex cross-sectional shape that hold the wiring layer 50 on the inside, and a connecting portion 32 that connects the pair of molded portions 31A and 31B. The substrate 30 is bent around the connecting portion 32 as the center, and the pair of molded portions 31A and 31B face each other.
Need to check novelty before this filing date? Find Prior Art