Method, system, electronic device, and storage medium for substrate thickness measurement and etching correction

TW202638690AInactive Publication Date: 2026-09-16CHUNGHWA PRECISION TEST TECH
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Patent Information

Application Number
TW114107750
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-03
Publication Date
2026-09-16
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present disclosure provides a method, system, electronic device, and storage medium for substrate thickness measurement and etching correction, configured to achieve automated measurement of substrate thickness and precise etching by: replacing manual measurement with automated thickness measurement while avoiding the design of blind holes to accomplish accurate measurement, then implementing feedback control through the acquired measurement data, and combining said feedback control with the precise positioning and spraying functions of horizontal etching equipment to perform thickness correction on target areas.
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