Fabricating method of package substrate

Abstract

A fabricating method of packaging substrate is to form a circuit structure with a plurality of electrical contact pads on a carrier, and then manufacture a flexible substrate with a plurality of solder bumps based on the positions of the plurality of electrical contact pads, and press the flexible substrate onto the circuit structure so that the solder bumps are bonded to the electrical contact pads, then remove the flexible substrate, and finally reflow the solder bumps to form solder balls. Therefore, by forming the solder bumps on the flexible substrate, the ball-placement process can be performed on the warped circuit structure.

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