Multi-layer circuit board and manufacturing method thereof

Abstract

The present invention provides a multi-layer circuit board and a manufacturing method thereof. The multi-layer circuit board includes a metal layer, a circuit board structure, a film and a filling material. The circuit board structure includes a substrate, a first copper layer and a second copper layer. The first copper layer and the second copper layer are formed on the substrate and are located on the same side of the substrate. The first copper layer and the second copper layer are spaced apart from each other. The film connects the metal layer and the circuit board structure, and the filling material is filled between the circuit board structure and the film. The film is connected to the first copper layer of the circuit board structure, the first copper layer has a first thickness, the second copper layer has a second thickness, and the first thickness is at least four times greater than the second thickness.

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