Electronic device and expansion module

Abstract

An electronic device comprising a casing and an expansion module. The casing includes an electronic component placement area, a routing area, and a vertical wall. The routing area is located between the electronic component placement area and the vertical wall. The expansion module is disposed in the routing area of the casing and includes a frame and a circuit board. The frame is fixed to the vertical wall. The frame includes a supporting portion, a first limiting portion, a second limiting portion and a plurality of cable management structures. The first limiting portion, the second limiting portion and the supporting portion together form an accommodation space. The cable management structures protrude from a second surface of the supporting portion and together form a cable management space. The accommodation space and the cable management space are located at two opposite sides of the frame. The circuit board is disposed in the accommodation space of the frame.

Description

[Technical Field]

[0001] This invention relates to an electronic device and an expansion module. [Previous Technology]

[0002] With the advancement and development of technology, electronic devices are increasingly equipped with electronic modules, resulting in more and more powerful functions. However, the limited internal space of electronic devices forces electronic modules to be placed in areas that house internal circuitry. However, because the circuitry in these areas is often disorganized, the assembly and disassembly of electronic modules are difficult. In view of this, researchers in this field are dedicated to solving the aforementioned problems. [Summary of the Invention]

[0003] The present invention provides an electronic device and an expansion module that allows the electronic module to be easily installed and removed from the wiring area inside the electronic device.

[0004] An electronic device disclosed in one embodiment of the present invention includes a housing and an expansion module. The housing includes an electronic component placement area, a wiring area, and a vertical wall, with the wiring area located between the electronic component placement area and the vertical wall. The expansion module is disposed in the wiring area of ​​the housing and includes a frame and a circuit board. The frame is fixed to the vertical wall. The frame includes a support portion, a first limiting portion, a second limiting portion, and a plurality of cable management structures. The first limiting portion, the second limiting portion, and the support portion together form a receiving groove. These cable management structures protrude from a second surface of the support portion and together form a cable management channel. The receiving groove and the cable management channel are located on opposite sides of the frame. The circuit board is disposed within the receiving groove of the frame.

[0005] Another embodiment of the present invention discloses an expansion module for installation between a vertical wall of a housing and an electronic component placement area. The expansion module includes a frame and a circuit board. The frame is fixed to the vertical wall. The frame includes a support portion, a first limiting portion, a second limiting portion, and a plurality of cable management structures. The first limiting portion, the second limiting portion, and the support portion together form a receiving groove. These cable management structures protrude from a second surface of the support portion and together form a cable management channel. The receiving groove and the cable management channel are located on opposite sides of the frame. The circuit board is disposed in the receiving groove of the frame.

[0006] According to the electronic device and expansion module disclosed in the above embodiments, the frame of the expansion module includes a cable management channel and a receiving channel. The receiving channel and the cable management channel are located on opposite sides of the frame, and the circuit board is disposed in the receiving channel of the frame. Even if the expansion module is disposed in the wiring area between the electronic component placement area and the vertical wall, the wires in the wiring area can be organized in the cable management channel of the frame to avoid affecting the disassembly and assembly of the expansion module.

[0007] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention.

Implementation Method

[0008] Please refer to Figures 1 and 2. Figure 1 is a partial perspective view of an electronic device 1 disclosed in one embodiment of the present invention. Figure 2 is an exploded view of the electronic device 1 of Figure 1. Figure 3 is a partial perspective view of the electronic device of Figure 1 from another perspective.

[0009] Electronic device 1 includes a housing 10 and an expansion module 20. The housing 10 includes an electronic component placement area 11, a wiring area 12, and a vertical wall 13. The electronic component placement area 11 is used, for example, to place memory S, wherein the memory S is plugged into a motherboard M inside the housing 10. The wiring area 12 is located between the electronic component placement area 11 and the vertical wall 13, and the wiring area 12 is used for multiple wires C inside the electronic device 1 to pass through. The expansion module 20 is, for example, a board management module. The expansion module 20 includes a frame 21 and a circuit board 22. The frame 21 is fixed to the vertical wall 13.

[0010] In one embodiment, the frame 21 may include a support portion 213, a first limiting portion 214, and a second limiting portion 215. The first limiting portion 214 and the second limiting portion 215 are connected to a first surface 2131 of the support portion 213 and are separate from each other. The first limiting portion 214, the second limiting portion 215, and the support portion 213 together form a receiving groove 212. The circuit board 22 is disposed in the receiving groove 212 of the frame 21 and is inserted into the main board M disposed in the housing 10. The support portion 213 is parallel to the vertical wall 13, and the first limiting portion 214 and the second limiting portion 215 are fixed to the vertical wall 13.

[0011] In one embodiment, the vertical wall 13 may include a first positioning groove 131 and a second positioning groove 132 that are separated from each other. The first limiting part 214 may include a positioning hook 2141, and the second limiting part 215 may include a positioning protrusion 2151. The positioning hook 2141 and the positioning protrusion 2151 are respectively separately positioned in the first positioning groove 131 and the second positioning groove 132. By matching the positioning hook 2141 and the positioning protrusion 2151 with the first positioning groove 131 and the second positioning groove 132 respectively, the expansion module 20 can be positioned at the desired location during the installation of the expansion module 20 in the wiring area 12, thereby restricting its displacement in the horizontal direction.

[0012] In one embodiment, the vertical wall 13 may further include a locking hole 133. The first limiting part 214 may include a connecting part 2142 and a spring arm part 2144. The positioning hook 2141 and the spring arm part 2144 are connected to the bearing part 213 through the connecting part 2142 and are separate from each other, and the positioning hook 2141 and the spring arm part 2144 are partially parallel to the bearing part 213. That is, the positioning hook 2141 and the spring arm part 2144 form a U-shaped structure with the bearing part 213 through the connecting part 2142. The spring arm part 2144 may include a locking block 21441, which is detachably locked into the locking hole 133 of the vertical wall 13. By using the locking block 21441 of the spring arm 2144 to lock into the locking hole 133 of the vertical wall 13, the user can know that the expansion module 20 is installed in place by the popping sound made by the locking block 21441 of the spring arm 2144 locking into the locking hole 133 of the vertical wall 13 during the process of installing the expansion module 20 in the wiring area 12, and the vertical displacement of the expansion module 20 is restricted.

[0013] Next, please refer to Figure 4, which is a partial cross-sectional view of the electronic device of Figure 1.

[0014] In one embodiment, the expansion module 20 may further include an operating member 23. The operating member 23 is, for example, a pull strap, and is connected to the spring arm portion 2144. By pulling the operating member 23 in a direction D away from the vertical wall 13, the locking block 21441 of the spring arm portion 2144 can be disengaged from the locking hole 133 of the vertical wall 13. In this way, the expansion module 20 can be separated from the housing 10.

[0015] In the above embodiments, by the matching of the positioning hook 2141 and the positioning protrusion 2151 with the first positioning groove 131 and the second positioning groove 132 respectively, the matching of the locking block 21441 of the spring arm 2144 with the locking hole 133 of the vertical wall 13, and the design of the operating member 23, the expansion module 20 can be installed and removed from the housing 10 without tools. It should be noted that the aforementioned structure and components for tool-free installation are optional. In other embodiments, the expansion module can be installed on the housing with tools. For example, the frame of the expansion module can be fixed to the vertical wall with screws, and the expansion module needs to be installed and removed with a screwdriver.

[0016] Next, please refer to Figures 4 and 5. Figure 5 is a perspective view of the expansion module 20 of Figure 1.

[0017] In some embodiments, the frame 21 may further include a plurality of cable management structures 216, which protrude from a second surface 2132 of the support portion 213 and together form a cable management groove 211. Referring also to FIG3, the cable management groove 211 is used to organize the wires C passing through the cable routing area 12. The receiving groove 212 and the cable management groove 211 are located on opposite sides of the frame 21.

[0018] In the above embodiment, the frame 21 of the expansion module 20 includes a cable management channel 211 and a receiving channel 212. The receiving channel 212 and the cable management channel 211 are located on opposite sides of the frame 21. The circuit board 22 is disposed in the receiving channel 212 of the frame 21. Even if the expansion module 20 is disposed in the wiring area 12 between the electronic component placement area 11 and the vertical wall 13, the wires C in the wiring area 12 can be organized in the cable management channel 211 of the frame 21. In this way, the wires C can be prevented from affecting the disassembly and assembly of the expansion module 20, the amount of cable ties used can be saved, and the wires C can be prevented from squeezing the memory S.

[0019] In some embodiments, these cable management structures 216 include a separating rib 2161 and at least one limiting wall 2162. The separating rib 2161 is provided to separate the upper edge U and lower edge L of the second surface 2132 of the support portion 213. The limiting wall 2162 is connected to the separating rib 2161 and extends parallel to the second surface 2132 of the support portion 213 toward the upper edge U and lower edge L of the support portion 213, thereby dividing the cable management groove 211 into two sub-grooves 2111. In this way, the wires C (as shown in FIG. 3) in the wiring area 12 can be arranged in layers via the two sub-grooves 2111.

[0020] In some embodiments, there may be multiple limiting walls 2162. These limiting walls 2162 are connected separately to the separating ribs 2161.

[0021] In some embodiments, these wiring structures 216 may further include at least one first limiting rib 2163 and at least one second limiting rib 2164. The first limiting rib 2163 is located at the upper edge U of the support portion 213 and is staggered with the limiting baffle 2162. The second limiting rib 2164 is located at the lower edge L of the support portion 213 and is staggered with the limiting baffle 2162. In some embodiments, the number of first limiting ribs 2163 and second limiting ribs 2164 may be multiple.

[0022] It should be noted that the structure of the frame 21 forming the receiving groove 212 is not limited to the above structure, but can be adjusted arbitrarily according to the needs.

[0023] According to the electronic device and expansion module disclosed in the above embodiments, the frame of the expansion module includes cable management channels and receiving channels, which are located on opposite sides of the frame. The circuit board is disposed within the receiving channels of the frame. Even if the expansion module is located in the wiring area between the electronic component placement area and the vertical wall, the wires in the wiring area can be organized in the cable management channels of the frame. This avoids the wires affecting the assembly and disassembly of the expansion module, saves on the amount of cable ties used, and prevents the wires from squeezing the memory.

[0024] In addition, by matching the positioning hook and positioning protrusion with the first positioning groove and the second positioning groove respectively, matching the locking block of the spring arm with the locking hole of the vertical wall, and the design of the operating component, the expansion module can be installed and removed from the housing without tools.

[0025] The electronic device and expansion module disclosed herein can be installed in a server, which can be used for artificial intelligence (AI) computing, edge computing, or as a 5G server, cloud server or vehicle networking server.

[0026] Although the present invention has been disclosed above with reference to the preferred embodiments described above, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to this specification. [Simplified Explanation of the Diagram]

[0027] FIG1 is a partial perspective view of an electronic device disclosed in one embodiment of the present invention. FIG2 is an exploded view of the electronic device of FIG1. ​​FIG3 is a partial perspective view of the electronic device of FIG1 from another perspective. FIG4 is a partial cross-sectional view of the electronic device of FIG1. ​​FIG5 is a perspective view of the expansion module of FIG1.

Claims

1. An electronic device, comprising: a housing including an electronic component placement area, a wiring area, and a vertical wall, the wiring area being located between the electronic component placement area and the vertical wall; and an expansion module disposed in the wiring area of ​​the housing and comprising: a frame fixed to the vertical wall, the frame including a support portion, a first limiting portion, a second limiting portion, and a plurality of cable management structures, the first limiting portion, the second limiting portion, and the support portion forming a receiving groove, the cable management structures protruding from a second surface of the support portion to form a cable management groove, the receiving groove and the cable management groove being located on opposite sides of the frame; and a circuit board disposed in the receiving groove of the frame.

2. The electronic device as claimed in claim 1, wherein the first limiting portion and the second limiting portion are connected to and separated from a first surface of the support portion, the support portion is parallel to the vertical wall, and the first limiting portion and the second limiting portion are fixed to the vertical wall.

3. The electronic device as claimed in claim 2, wherein the vertical wall includes a first positioning groove and a second positioning groove that are separated from each other, the first limiting portion includes a positioning hook, the second limiting portion includes a positioning protrusion, and the positioning hook and the positioning protrusion are respectively separably positioned in the first positioning groove and the second positioning groove.

4. The electronic device as claimed in claim 3, wherein the vertical wall further includes a locking hole, the first limiting portion further includes a connecting portion and a spring arm portion, the positioning hook and the spring arm portion are connected to the bearing portion through the connecting portion and are separate from each other, the positioning hook and the spring arm portion are partially parallel to the bearing portion, and the spring arm portion includes a locking block that is detachably locked to the locking hole of the vertical wall.

5. The electronic device as claimed in claim 4, wherein the expansion module further includes an operating element connected to the spring arm.

6. The electronic device as claimed in claim 1, wherein the cable management structure includes a separating rib and a limiting wall, the separating rib being configured to separate the upper edge and lower edge of the second surface of the support portion, the limiting wall being connected to the separating rib, the limiting wall being parallel to the second surface of the support portion and extending toward the upper edge and lower edge of the support portion, thereby dividing the cable management channel into two sub-channels.

7. The electronic device as claimed in claim 6, wherein the wiring structure further includes a first limiting rib and a second limiting rib, the first limiting rib being located at the upper edge of the support portion and interleaved with the limiting wall, and the second limiting rib being located at the lower edge of the support portion and interleaved with the limiting wall.

8. An expansion module for mounting between a vertical wall of a housing and an electronic component placement area, the expansion module comprising: a frame for fixing to the vertical wall, and including a support portion, a first limiting portion, a second limiting portion, and a plurality of cable management structures, the first limiting portion, the second limiting portion, and the support portion together forming a receiving groove, the cable management structures protruding from a second surface of the support portion to jointly form a cable management channel, the receiving groove and the cable management channel being located on opposite sides of the frame; and a circuit board disposed in the receiving groove of the frame.

9. The expansion module as claimed in claim 8, wherein the first limiting portion and the second limiting portion are connected to and separated from a first surface of the support portion, the support portion is parallel to the vertical wall, and the first limiting portion and the second limiting portion are used to fix to the vertical wall.

10. The expansion module as claimed in claim 8, wherein the cable management structures include a separating rib and a limiting wall, the separating rib being configured to separate the upper edge and lower edge of the second surface of the support portion, the limiting wall being connected to the separating rib, the limiting wall being parallel to the second surface of the support portion and extending toward the upper edge and lower edge of the support portion, thereby dividing the cable management groove into two sub-grooves.

Images