Liquid cooling system

Abstract

A liquid cooling system includes a plurality of first liquid cooling plates and a plurality of liquid cooling modules. The first liquid cooling plates are configured to respectively thermally contact a plurality of first heating elements, and the first liquid cooling plates are connected in series and in fluid communication connection with each other. The liquid cooling modules are connected in series and in fluid communication connection with each other. Each liquid cooling module includes two divergence parts and a plurality of second liquid cooling plates. The divergence parts are in fluid communication connection with the first liquid plates. Each divergence part has a plurality of divergence holes. The second liquid cooling plates are configured to thermally contact a plurality of second heating elements. The second liquid cooling plates are disposed between the divergence parts, and the second liquid cooling plates are in fluid communication connection with the divergence parts via the divergence holes, respectively. The first liquid cooling plates and the liquid cooling modules are connected in series and in fluid communication connection with each other.

Description

[Technical Field]

[0001] This invention relates to a liquid cooling system, and more particularly to a liquid cooling system for memory. [Previous Technology]

[0002] With the development of technology, for example, the amount of data that DIMM (Dual In-line Memory Module) memory needs to process has increased significantly, which has led to an increase in the power consumption of memory and a large amount of waste heat.

[0003] However, in most general servers, air cooling systems are still used to provide airflow to the memory to remove waste heat, but such air cooling systems can no longer cool the high-power memory in time. [Summary of the Invention]

[0004] The present invention provides a liquid cooling system that can provide a suitable cooling mechanism for memory.

[0005] One embodiment of the present invention discloses a liquid cooling system comprising a plurality of first liquid cooling plates and a plurality of liquid cooling modules. The first liquid cooling plates are used to thermally contact a plurality of first heating elements, and are connected in series and interconnected. The liquid cooling modules are connected in series and interconnected. Each liquid cooling module includes two flow distribution sections and a plurality of second liquid cooling plates. The flow distribution sections are connected to the first liquid cooling plates. Each flow distribution section has a plurality of flow distribution holes. The second liquid cooling plates are used to thermally contact a plurality of second heating elements. The second liquid cooling plates are disposed between the flow distribution sections, and are connected to the flow distribution sections through the flow distribution holes. The first liquid cooling plates and the liquid cooling modules are connected in series and interconnected.

[0006] According to the liquid cooling system disclosed in the above embodiments, in addition to using the first liquid cooling plate to absorb the heat generated by the first heating element, the first liquid cooling plate used for the first heating element can also be connected in series to the second liquid cooling plate, so as to absorb the heat generated by the second heating element during operation through the second liquid cooling plate, thereby preventing heat from accumulating around the second heating element and affecting the normal operation of the second heating element.

[0007] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention.

Implementation Method

[0008] Please refer to Figures 1 and 2, wherein Figure 1 is a perspective view of a liquid cooling system according to an embodiment of the present invention, and Figure 2 is an exploded view of some components of the liquid cooling system of Figure 1.

[0009] The liquid cooling system 10 provided in this embodiment is applied, for example, inside the chassis of a server. The liquid cooling system 10 includes a plurality of first liquid cooling plates 11, a plurality of liquid cooling modules 12, and a plurality of connecting pipes 13.

[0010] The number of first liquid cooling plates 11 is, for example, two. Specifically, the first liquid cooling plate 11 includes a front first liquid cooling plate 11a and a rear first liquid cooling plate 11b. The front first liquid cooling plate 11a and the rear first liquid cooling plate 11b are connected in series and communicate with each other. The front first liquid cooling plate 11a and the rear first liquid cooling plate 11b are used to make thermal contact with a plurality of first heating elements 20, wherein the first heating element 20 is, for example, a central processing unit (CPU).

[0011] The number of liquid cooling modules 12 is, for example, four. Specifically, the liquid cooling module 12 includes a first liquid cooling module 12a, a second liquid cooling module 12b, a third liquid cooling module 12c, and a fourth liquid cooling module 12d. The first liquid cooling module 12a, the second liquid cooling module 12b, the third liquid cooling module 12c, and the fourth liquid cooling module 12d are connected in series and interconnected with each other.

[0012] Please refer to Figure 3 together with Figures 1 to 2, wherein Figure 3 is an exploded schematic diagram of some components of the liquid cooling system in Figure 2.

[0013] Each liquid cooling module 12 includes two flow distribution sections 121, multiple second liquid cooling plates 122 and multiple flexible thermal pads 123.

[0014] The diversion section 121 is made of copper, for example. The diversion section 121 is connected to the first liquid cooling plate 11. Each diversion section 121 has a plurality of diversion holes 1211, and the number of diversion holes 1211 in each diversion section 121 is, for example, seven. In this embodiment, one of the diversion sections 121 of the second liquid cooling module 12b and one of the diversion sections 121 of the third liquid cooling module 12c are integrally formed, and the other diversion section 121 of the second liquid cooling module 12b and the other diversion section 121 of the third liquid cooling module 12c are integrally formed. However, the present invention is not limited thereto.

[0015] The second liquid cooling plate 122 is made of, for example, SAE 304 stainless steel, which helps to improve durability and heat dissipation. In each liquid cooling module 12, the number of second liquid cooling plates 122 is, for example, seven. These second liquid cooling plates 122 are disposed between two flow dividers 121, and these second liquid cooling plates 122 are connected to the flow dividers 121 through flow divider holes 1211. Specifically, each second liquid cooling plate 122 has a lug 1221 at each of its opposite ends, and the lugs 1221 of these second liquid cooling plates 122 are respectively inserted into the flow divider holes 1211 to secure the connection between the second liquid cooling plate 122 and the flow divider 121. The lugs 1221 and the flow divider 121 are connected by welding to enhance the tightness of the connection between the second liquid cooling plate 122 and the flow divider 121. However, the present invention is not limited to the welding connection method.

[0016] The second liquid cooling plate 122 has internal channels for coolant (e.g., water, not shown separately) to flow through, as shown by the dashed lines inside the second liquid cooling plate 122 in Figure 3. The second liquid cooling plate 122 is used to make thermal contact with multiple second heating elements 22, wherein the second heating elements 22 are, for example, DIMM-sized memory chips. Alternatively, the second liquid cooling plate 122 is used to hold the second heating elements 22. Alternatively, the second heating elements 22 are disposed between two second liquid cooling plates 122. In this way, the second liquid cooling plate 122 can absorb the heat generated by the second heating elements 22 during operation, preventing heat from accumulating around the second heating elements 22 and affecting their normal operation.

[0017] Furthermore, each of the second liquid cooling plates 122 has a clearance groove 1222 to avoid interference with the protrusions (not otherwise labeled) on the second heating element 22 and to facilitate the insertion and removal of the second heating element 22. Note that the clearance groove 1222 is an optional design. In some embodiments, the second liquid cooling plate may not have a clearance groove. In addition, when inserting or removing the second heating element 22, it is not necessary to remove the liquid cooling module 12, thus avoiding the risk of coolant leakage.

[0018] In each liquid cooling module 12, the number of flexible thermal pads 123 is, for example, seven. These flexible thermal pads 123 are made of, for example, polyimide (PI) and are flexible. The flexible thermal pads 123 are respectively disposed on the outer side of the second liquid cooling plate 122. By means of the flexible design of the flexible thermal pads 123, the uneven surface of the second heating element 22 can be tightly attached to the flexible thermal pads 123, and sufficient heat exchange can be achieved between the flexible thermal pads 123 and the second liquid cooling plate 122, thereby enhancing the heat conduction between the second liquid cooling plate 122 and the second heating element 22.

[0019] The number of connecting pipes 13 is, for example, two. The connecting pipes 13 are, for example, made of polytetrafluoroethylene (PTFE) and are flexible. The connecting pipes 13 are respectively connected to the first liquid cooling module 12a and the second liquid cooling module 12b, and the third liquid cooling module 12c and the fourth liquid cooling module 12d.

[0020] Please note that the number of the above-mentioned components is not intended to limit the invention.

[0021] With the above configuration, the first liquid cooling plate 11 and the liquid cooling module 12 can be connected in series and communicate with each other. Furthermore, the front first liquid cooling plate 11a, the rear first liquid cooling plate 11b, the first liquid cooling module 12a, the second liquid cooling module 12b, the third liquid cooling module 12c and the fourth liquid cooling module 12d of the liquid cooling system 10 form only one series-connected pipeline.

[0022] Specifically, as shown by arrow AA in Figure 1, the liquid cooling system 10 supplies coolant to flow into the front first liquid cooling plate 11a. After exchanging heat with one of the first heating elements 20, the coolant leaves the front first liquid cooling plate 11a. Then, as shown by arrow BB in Figure 1, the coolant flows into the rear first liquid cooling plate 11b. After exchanging heat with the other first heating element 20, the coolant leaves the rear first liquid cooling plate 11b.

[0023] Next, as shown by arrow CC in FIG1, the coolant flows into one of the branch sections 121 of the first liquid cooling module 12a. Next, as shown by arrow DD in FIG1, the coolant flows through the second liquid cooling plate 122 of the first liquid cooling module 12a to complete heat exchange with the second heating element 22, and then flows into the other branch section 121 of the first liquid cooling module 12a. Next, as shown by arrow EE in FIG1, the coolant flows into one of the branch sections 121 of the second liquid cooling module 12b via one of the connecting pipes 13.

[0024] Next, as shown by arrow FF in FIG1, the coolant flows through the second liquid cooling plate 122 of the second liquid cooling module 12b to complete heat exchange with the second heating element 22. The coolant then flows into another branch section 121 of the second liquid cooling module 12b. Next, as shown by arrow GG in FIG1, the coolant flows from another branch section 121 of the second liquid cooling module 12b into one of the branch sections 121 of the third liquid cooling module 12c.

[0025] Next, as shown by arrow HH in FIG1, the coolant flows through the second liquid cooling plate 122 of the third liquid cooling module 12c to complete heat exchange with the second heating element 22, and then flows into another branch section 121 of the third liquid cooling module 12c. Next, as shown by arrow II in FIG1, the coolant flows into one of the branch sections 121 of the fourth liquid cooling module 12d via another connecting pipe 13.

[0026] Please note that in the second liquid cooling module 12b and the third liquid cooling module 12c, the two integrally formed flow dividers 121 of one set are directly connected internally, thus completing the flow direction indicated by arrow GG above. Please note that in the second liquid cooling module 12b and the third liquid cooling module 12c, the two integrally formed flow dividers 121 of the other set are not directly connected internally, therefore the flow direction indicated by arrow EE above cannot be directly connected to the flow direction indicated by arrow II above.

[0027] Next, as shown by arrow JJ in Figure 1, the coolant flows through the second liquid cooling plate 122 of the fourth liquid cooling module 12d to exchange heat with the second heating element 22, and then flows into another branch section 121 of the fourth liquid cooling module 12d. Next, as shown by arrow KK in Figure 1, the coolant leaves the fourth liquid cooling module 12d.

[0028] According to the liquid cooling system of the above embodiment, in addition to using the first liquid cooling plate to absorb the heat generated by the first heating element, the first liquid cooling plate for the first heating element can also be connected in series with the second liquid cooling plate, so as to absorb the heat generated by the second heating element during operation through the second liquid cooling plate, thereby preventing heat from accumulating around the second heating element and affecting its normal operation. Simulation tests show that the liquid cooling system of the present invention can maintain the second heating element at an operating temperature below 67.3°C.

[0029] Furthermore, the liquid cooling system forms only one series-connected pipeline. In addition, the liquid cooling system with a series-connected pipeline can increase the temperature difference between the inlet and outlet of the coolant, thereby making heat exchange more efficient and saving the operating cost of liquid cooling.

[0030] Furthermore, the clearance groove of the second liquid cooling plate can prevent interference with the protrusion on the second heating element and facilitate the insertion and removal of the second heating element. In addition, when inserting or removing the second heating element, it is not necessary to remove the liquid cooling module, thus avoiding the risk of coolant leakage.

[0031] Furthermore, by means of the flexible design of the flexible heat-conducting pad, the uneven surface of the second heating element can be tightly attached to the flexible heat-conducting pad, and the flexible heat-conducting pad and the second liquid cooling plate can achieve a full heat exchange effect, thereby enhancing the heat conduction between the second liquid cooling plate and the second heating element.

[0032] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to this specification. [Simplified Explanation of the Diagram]

[0033] Figure 1 is a perspective view of a liquid cooling system according to an embodiment of the present invention. Figure 2 is an exploded view of some components of the liquid cooling system of Figure 1. Figure 3 is an exploded view of some components of the liquid cooling system of Figure 2.

Claims

1. A liquid cooling system, comprising: a plurality of first liquid cooling plates, including a front first liquid cooling plate and a rear first liquid cooling plate, the front first liquid cooling plate and the rear first liquid cooling plate being used to thermally contact a plurality of first heating elements respectively, wherein the front first liquid cooling plate and the rear first liquid cooling plate are connected in series and communicate with each other; and a plurality of liquid cooling modules, including a first liquid cooling module, a second liquid cooling module, a third liquid cooling module and a fourth liquid cooling module, the first liquid cooling module, the second liquid cooling module, the third liquid cooling module and the fourth liquid cooling module being connected in series and communicate with each other, the liquid cooling system being used to allow a coolant to flow sequentially through the front first liquid cooling plate, the rear first liquid cooling plate, and the first liquid cooling module. The second, third, and fourth liquid-cooling modules, with the front first liquid-cooling plate, the rear first liquid-cooling plate, the first liquid-cooling module, the second liquid-cooling module, the third liquid-cooling module, and the fourth liquid-cooling module forming only one series-connected pipeline, each of the first, second, third, and fourth liquid-cooling modules includes: two flow distribution sections connecting the first liquid-cooling plates, each flow distribution section having multiple flow distribution holes; and multiple second liquid-cooling plates for thermal contact with multiple second heating elements, wherein the second liquid-cooling plates are disposed between the flow distribution sections, and the second liquid-cooling plates are respectively connected to the flow distribution sections through the flow distribution holes; wherein... These first liquid cooling plates are connected in series with these liquid cooling modules and are interconnected with each other.

2. The liquid cooling system as claimed in claim 1, wherein each of the second liquid cooling plates has a lug at each of its opposite ends, and the lugs of the second liquid cooling plates are respectively inserted into the diversion holes to secure the connection between the second liquid cooling plates and the diversion holes.

3. The liquid cooling system as claimed in claim 2, wherein the lugs and the flow dividers are connected by welding to enhance the tightness of the connection between the second liquid cooling plates and the flow dividers.

4. The liquid cooling system as claimed in claim 1, wherein the second liquid cooling plates are used to hold the second heating elements, and each of the second liquid cooling plates has a clearance groove to avoid interference with the protrusions on the second heating elements.

5. The liquid cooling system as claimed in claim 1, wherein each of the liquid cooling modules further comprises a plurality of flexible thermal pads, the flexible thermal pads being flexible, the flexible thermal pads being disposed on the outer side of the second liquid cooling plates to enhance the heat conduction between the second liquid cooling plates and the second heating elements.

6. The liquid cooling system as described in claim 5, wherein the flexible thermal pads are made of polyimide.

7. The liquid cooling system as claimed in claim 1, wherein one of the flow distribution sections of the second liquid cooling module and one of the flow distribution sections of the third liquid cooling module are integrally formed, and the other flow distribution section of the second liquid cooling module and the other flow distribution section of the third liquid cooling module are integrally formed.

8. The liquid cooling system as claimed in claim 1 further includes a plurality of connecting pipes, wherein the connecting pipes are made of polytetrafluoroethylene and are flexible, and the connecting pipes respectively connect the first liquid cooling module and the second liquid cooling module, and the third liquid cooling module and the fourth liquid cooling module.

Images