Liquid cooling system

Abstract

A liquid cooling system includes a divergence part, a convergence part, a plurality of liquid cooling plates and a plurality of thermal transfer modules. The divergence part has a divergence inlet and a plurality of divergence outlets that are in fluid communication connection with each other. The convergence part has a plurality of convergence inlets and a convergence outlet. The liquid cooling plates are in fluid communication connection with each other and are respectively in fluid communication connection with one divergence inlet and one convergence inlet. Each thermal transfer module includes a support element, a heat-transfer element and a plurality of heat pipes. The support elements and the heat-transfer elements are disposed opposite to each other. The heat-transfer elements have a plurality of inner channels being in fluid communication connection with each other and being respectively in fluid communication connection with another support element and another heat-transfer element. The heat pipes thermally contact the heat-transfer elements. The liquid cooling system and the heat-transfer element are connected in parallel and respectively form fluid communication connections between the divergence part and the convergence part.

Description

[Technical Field]

[0001] This invention relates to a liquid cooling system, and more particularly to a liquid cooling system for memory. [Previous Technology]

[0002] With the development of technology, for example, the amount of data that DIMM (Dual In-line Memory Module) memory needs to process has increased significantly, which has led to an increase in the power consumption of memory and a large amount of waste heat.

[0003] However, in most general servers, air cooling systems are still used to provide airflow to the memory to remove waste heat, but such air cooling systems can no longer cool the high-power memory in time. [Summary of the Invention]

[0004] The present invention provides a liquid cooling system that can provide a suitable cooling mechanism for memory.

[0005] An embodiment of the liquid cooling system disclosed in this invention includes a distribution section, a confluence section, multiple liquid cooling plates, and multiple heat-conducting modules. The distribution section has a distribution inlet and multiple distribution outlets that are interconnected. The confluence section has multiple confluence inlets and a confluence outlet that are interconnected. The liquid cooling plates are used to thermally contact multiple first heating elements respectively. The liquid cooling plates are interconnected and each connects one of the distribution outlets to one of the confluence inlets. Each heat-conducting module includes a support member, a heat-conducting element, and multiple heat pipes. The heat-conducting element is disposed opposite to the support member. The heat-conducting element has an internal flow channel. The heat pipes are used to thermally contact multiple second heating elements. The opposite sides of each heat pipe are respectively disposed on the support member and the heat-conducting element, and the heat pipes thermally contact the heat-conducting element. The internal flow channels of these heat-conducting modules are interconnected and each connects the other of the distribution outlets to the other of the confluence inlets. These liquid cooling plates are connected in parallel with these heat-conducting modules between the branch section and the junction section.

[0006] According to the liquid cooling system disclosed in the above embodiments, in addition to using a liquid cooling plate to absorb the heat generated by the first heating element, the liquid cooling plate used for the first heating element can also be connected in parallel to the heat conduction module, so as to absorb the heat generated by the second heating element during operation through the heat pipe of the heat conduction module, thereby preventing heat from accumulating around the second heating element and affecting the normal operation of the second heating element.

[0007] Furthermore, the heat pipe can transfer the absorbed heat to the heat-conducting component, so that the heat can be further removed by the coolant through the inner channel.

[0008] Furthermore, the heat pipe design prevents the coolant from getting too close to the second heating element, reducing the risk of coolant leakage affecting the second heating element. Also, no additional power is required to power the heat pipe, saving energy.

[0009] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide a further explanation of the scope of the patent application of the present invention.

Implementation Method

[0010] Please refer to Figures 1 and 2, wherein Figure 1 is a perspective view of a liquid cooling system according to an embodiment of the present invention, and Figure 2 is an exploded view of some components of the liquid cooling system of Figure 1.

[0011] The liquid cooling system 10 provided in this embodiment is applied, for example, inside the chassis of a server. The liquid cooling system 10 includes a distribution section 11, a junction section 12, a plurality of liquid cooling plates 13, and a plurality of heat-conducting modules 14.

[0012] The diversion section 11 is made of stainless steel, for example. The diversion section 11 has a diversion inlet 111 and a plurality of diversion outlets 112 that are connected to each other, wherein the number of diversion outlets 112 is, for example, two.

[0013] The manifold 12 is made of stainless steel, for example. The manifold 12 has a plurality of manifold inlets 121 that are interconnected with each other and a manifold outlet 122, wherein the number of manifold inlets 121 is, for example, two.

[0014] The number of liquid cooling plates 13 is, for example, two. The liquid cooling plates 13 are used to make thermal contact with a plurality of first heating elements 20, wherein the first heating elements 20 are, for example, central processing units (CPUs). The liquid cooling plates 13 are connected to each other and are respectively connected to one of the branch outlets 112 and one of the confluence inlets 121.

[0015] The number of thermal conductive modules 14 is, for example, two. Each thermal conductive module 14 includes a support 141, a thermal conductive element 142, multiple heat pipes 143 and multiple flexible thermal pads 144.

[0016] The support member 141 is made of copper, for example. Each support member 141 has a reinforcing structure 1411 and a plurality of first placement slots 1412. The reinforcing structure 1411 is, for example, a square protrusion, which can increase the structural strength of the support member 141. The first placement slots 1412 are, for example, elongated grooves, which can accommodate the heat pipe 143 and are located on opposite sides of the reinforcing structure 1411.

[0017] Please refer to Figures 3 and 4 together with Figures 1 to 2, wherein Figure 3 is an exploded view of the heat-conducting component of the liquid cooling system in Figure 2, and Figure 4 is a cross-sectional view of the heat-conducting component in Figure 3.

[0018] The heat-conducting component 142 is disposed relative to the support component 141. The heat-conducting component 142 is made of, for example, copper, which helps to improve durability. The heat-conducting component 142 has an internal flow channel 1420. In these heat-conducting modules 14, the internal flow channels 1420 are interconnected and respectively connected to another branch outlet 112 and another confluence inlet 121.

[0019] In detail, each heat-conducting component 142 includes a top cover 1421 and a base 1422. The top cover 1421 is disposed on the base 1422 and together with the base 1422 forms the aforementioned inner flow channel 1420. The top cover 1421 includes a liquid inlet channel 1421a, a liquid outlet channel 1421b, a plurality of second placement slots 1421c, and a plurality of fins 1421d. The liquid inlet channel 1421a connects the inner flow channel 1420 to the aforementioned other branch outlet 112. The liquid outlet channel 1421b connects the inner flow channel 1420 to the aforementioned other confluence inlet 121. The second placement slot 1421c is, for example, an elongated groove, which allows the heat pipe 143 to be disposed and is located on opposite sides of the liquid inlet channel 1421a and the liquid outlet channel 1421b. The fins 1421d are located within the inner flow channel 1420 and are disposed at positions corresponding to the second placement slots 1421c.

[0020] The base 1422 has an extension wall 1422a. The extension wall 1422a is disposed in the inner flow channel 1420 and located between the liquid inlet channel 1421a and the liquid outlet channel 1421b, and the extension wall 1422a extends from the position corresponding to the liquid inlet channel 1421a and the liquid outlet channel 1421b to the position corresponding to the second placement slot 1421c.

[0021] The connection between the inlet channel 1421a and the outlet channel 1421b is further explained below, please refer to Figure 4. As shown by arrows ww and xx in Figure 4, the coolant (e.g., water, not shown separately) flowing into the inner flow channel 1420 from the inlet channel 1421a flows along the extension wall 1422a to the fins 1421d to exchange heat with one of the fins 1421d. Then, the coolant flows along the other side of the extension wall 1422a, through the other side of the fins 1421d to exchange heat, and then flows to the outlet channel 1421b, as shown by arrows yy and zz in Figure 4.

[0022] The heat pipe 143 is a flat tube and is flat in shape. The heat pipe 143, for example, transfers heat from the center to the opposite sides. The opposite sides of each heat pipe 143 are respectively provided in the first placement groove 1412 of the support member 141 and the second placement groove 1421c of the heat conductor 142 to make thermal contact with the support member 141 and the heat conductor 142.

[0023] The heat pipe 143 is used to make thermal contact with a plurality of second heating elements 22. Alternatively, the heat pipe 143 is used to clamp the second heating elements 22. In this way, the heat generated by the second heating elements 22 during operation can be absorbed through the heat pipe 143, preventing heat from accumulating around the second heating elements 22 and affecting their normal operation. Furthermore, the heat pipe 143 can transfer the absorbed heat to the first placement tank 1412 and the second placement tank 1421c. The heat transferred to the first placement tank 1412 can be carried away by the airflow around the support member 141, and the heat transferred to the second placement tank 1421c can be further transferred to the fins 1421d, so that the heat can be further carried away by the coolant passing through the fins 1421d.

[0024] The design of the heat pipe 143 prevents the coolant from getting too close to the second heating element 22, thereby reducing the risk of coolant leakage affecting the second heating element 22. Furthermore, the flat shape of the heat pipe 143 saves space and facilitates the placement of the second heating element 22. Also, no additional power is required to the heat pipe 143, saving energy.

[0025] Furthermore, each of the heat pipes 143 is curved to avoid interference with the protrusions (not otherwise labeled) on the second heating element 22 and to facilitate the insertion and removal of the second heating element 22. Note that the curved shape of the heat pipes 143 is an optional design. In some embodiments, the heat pipes may also be straight. In addition, due to the design of the heat pipes 143, the heat-conducting component 142 does not need to be removed when inserting or removing the second heating element 22, thus avoiding the risk of coolant leakage.

[0026] The flexible thermal pad 144 is made of, for example, polyimide (PI) and is flexible. The flexible thermal pad 144 is disposed on the outside of the heat pipe 143. Due to the flexible design of the flexible thermal pad 144, the uneven surface of the second heating element 22 can be tightly attached to the flexible thermal pad 144, and sufficient heat exchange can be achieved between the flexible thermal pad 144 and the heat pipe 143, thereby enhancing the heat conduction between the heat pipe 143 and the second heating element 22.

[0027] Please note that the number of the above-mentioned components is not intended to limit the invention.

[0028] With the above configuration, the liquid cooling plate 13 and the heat-conducting module 14 can be connected in parallel between the distribution section 11 and the junction section 12. Furthermore, the liquid cooling system 10 provides two connecting pipes for coolant flow. In one connecting pipe, the coolant flows sequentially through the distribution inlet 111, one distribution outlet 112, the liquid cooling plate 13, one junction inlet 121, and one junction outlet 122. In the other connecting pipe, the coolant flows sequentially through the distribution inlet 111, another distribution outlet 112, the inner flow channel 1420 of the heat-conducting component 142, another junction inlet 121, and one junction outlet 122.

[0029] Specifically, in one of the connecting pipes, as shown by arrow AA in FIG1, coolant flows into the branch section 11 via the branch inlet 111. Then, as shown by arrow BB in FIG1, coolant flows out of the branch section 11 via one of the branch outlets 112 and flows into one of the liquid cooling plates 13. Next, as shown by arrow CC in FIG1, coolant flows out from one of the liquid cooling plates 13 and flows into another liquid cooling plate 13. Next, as shown by arrow DD in FIG1, coolant flows out from the other liquid cooling plate 13 and flows into the manifold section 12 via one of the manifold inlets 121. Finally, as shown by arrow EE in FIG1, coolant flows out of the manifold section 12 via the manifold outlet 122.

[0030] In another connecting pipe, as shown by arrow AA in Figure 1, coolant flows into the branch section 11 via branch inlet 111. Then, as shown by arrow KK in Figure 1, coolant flows out of the branch section 11 via another branch outlet 112 and flows into one of the heat-conducting components 142. Next, as shown by arrow LL in Figure 1, coolant flows from one heat-conducting component 142 to another heat-conducting component 142. Next, as shown by arrow MM in Figure 1, coolant flows out of the other heat-conducting component 142 and flows into the manifold section 12 via another manifold inlet 121. Next, as shown by arrow EE in Figure 1, coolant flows out of the manifold section 12 via manifold outlet 122. The flow of coolant inside the heat-conducting component 142 is described above in relation to arrows ww, xx, yy, and zz, and will not be repeated here.

[0031] Please note that the number of connecting pipes in the liquid cooling system 10 that are connected in parallel between the branch section 11 and the junction section 12 can be changed by increasing or decreasing the number of liquid cooling plates 13 and heat conduction modules 14. The present invention is not limited to the number of connecting pipes.

[0032] According to the liquid cooling system of the above embodiment, in addition to using a liquid cooling plate to absorb the heat generated by the first heating element, the liquid cooling plate for the first heating element can also be connected in parallel to the heat-conducting module. This allows the heat generated by the second heating element during operation to be absorbed through the heat pipes of the heat-conducting module, preventing heat accumulation around the second heating element and thus avoiding interference with its normal operation. Simulation tests show that the liquid cooling system of the present invention can maintain the second heating element at an operating temperature below 82°C.

[0033] Furthermore, the heat pipe can transfer the absorbed heat to the first placement tank and the second placement tank. The heat transferred to the first placement tank can be carried away by the airflow around the support, and the heat transferred to the second placement tank can be transferred to the fins, so that the heat can be further carried away by the coolant passing through the fins.

[0034] Furthermore, the heat pipe design prevents the coolant from getting too close to the second heating element, reducing the risk of coolant leakage affecting the second heating element. Additionally, the flat shape of the heat pipe saves space and facilitates the placement of the second heating element. Moreover, no additional power is required to power the heat pipe, saving energy.

[0035] Furthermore, the curved shape of the heat pipe avoids interference with the protruding part on the second heating element and facilitates the insertion and removal of the second heating element. In addition, due to the design of the heat pipe, the heat-conducting component does not need to be removed when inserting or removing the second heating element, thus avoiding the risk of coolant leakage.

[0036] Furthermore, by means of the flexible design of the flexible heat-conducting pad, the uneven surface of the second heating element can be tightly attached to the flexible heat-conducting pad, and the heat exchange effect between the flexible heat-conducting pad and the heat pipe can be fully achieved, thereby enhancing the heat conduction between the heat pipe and the second heating element.

[0037] Although the present invention has been disclosed above with reference to the foregoing embodiments, it is not intended to limit the present invention. Any person skilled in the art may make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of the patent application attached to this specification. [Simplified Explanation of the Diagram]

[0038] Figure 1 is a perspective view of a liquid cooling system according to an embodiment of the present invention. Figure 2 is an exploded view of some components of the liquid cooling system of Figure 1. Figure 3 is an exploded view of the heat-conducting component of the liquid cooling system of Figure 2. Figure 4 is a cross-sectional view of the heat-conducting component of Figure 3.

Claims

1. A liquid cooling system, comprising: a branch section having a branch inlet and a plurality of branch outlets communicating with each other; a confluence section having a plurality of confluence inlets and a confluence outlet communicating with each other; a plurality of liquid cooling plates for respectively thermally contacting a plurality of first heating elements, wherein the liquid cooling plates are interconnected and respectively connect one of the branch outlets to one of the confluence inlets; and a plurality of heat-conducting modules, each heat-conducting module comprising: a support member; a heat-conducting element disposed opposite to the support member, wherein the heat-conducting element has an internal flow channel; and a plurality of heat pipes for thermally contacting a plurality of second heating elements, wherein opposite sides of each heat pipe are respectively disposed on the support member and the heat-conducting element, and the heat pipes are in thermal contact with the heat-conducting element; wherein, The internal flow channels of these heat-conducting modules are interconnected and respectively connect one of the branch outlets and one of the confluence inlets; wherein the liquid cooling plates are connected in parallel with the heat-conducting modules between the branch section and the confluence section.

2. The liquid cooling system as claimed in claim 1, wherein each of the heat-conducting components includes a base and a top cover, the top cover being disposed on the base and forming the inner flow channel together with the base, the top cover including an inlet channel, an outlet channel and a plurality of placement slots, the inlet channel and the outlet channel communicating with the inner flow channel, the placement slots being for the heat pipes and located on at least one side of the inlet channel and the outlet channel, the base having an extension wall disposed within the inner flow channel and located between the inlet channel and the outlet channel, and the extension wall extending from a position corresponding to the inlet channel and the outlet channel to a position corresponding to the placement slots.

3. The liquid cooling system as claimed in claim 2, wherein the top cover further comprises a plurality of fins, and the fins are located within the inner flow channel and disposed at positions corresponding to the placement slots.

4. The liquid cooling system as claimed in claim 1, wherein each of the support members has a reinforcing structure and a plurality of placement slots for the heat pipes to be disposed and located on at least one side of the reinforcing structure.

5. The liquid cooling system as described in claim 1, wherein the heat pipes are in thermal contact with the support.

6. The liquid cooling system as described in claim 1, wherein the heat pipes are flat tubes and are flat in shape.

7. The liquid cooling system as claimed in claim 1, wherein the heat pipes are used to hold the second heating elements, and each of the heat pipes is bent to avoid interference with protrusions on the second heating elements.

8. The liquid cooling system as claimed in claim 1, wherein each of the thermally conductive modules further comprises a plurality of flexible thermally conductive pads, the flexible thermally conductive pads being flexible and disposed on the outside of the heat pipes to enhance thermal conduction between the heat pipes and the second heating elements.

9. The liquid cooling system as described in claim 8, wherein the flexible thermal pads are made of polyimide.

10. The liquid cooling system as claimed in claim 1, wherein the liquid cooling system is configured to allow a coolant to flow sequentially through the branch inlet, one of the branch outlets, the liquid cooling plates, one of the manifolds and the manifold, or sequentially through the branch inlet, another of the branch outlets, the internal channels of the heat-conducting components, another of the manifolds and the manifold.

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