Shielded Flexible Printed Wiring Board

TW202638723APending Publication Date: 2026-09-16TATSUTA ELECTRICWIRE & CABLE
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Patent Information

Application Number
TW114138329
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-22
Filing Date
2025-10-03
Publication Date
2026-09-16

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Abstract

The objective of this invention is to provide a shielded flexible printed circuit board with a conductive path, which achieves a reduced thickness despite having electromagnetic wave shielding on both sides. A shielded flexible printed circuit board comprises: a flexible printed circuit board having a substrate layer with a grounding circuit formed thereon; a first electromagnetic wave shielding layer deposited on a first surface of the flexible printed circuit board; a second electromagnetic wave shielding layer deposited on a second surface of the flexible printed circuit board opposite to the first surface; a first conductive adhesive layer that attaches the first electromagnetic wave shielding layer to the first surface and makes it conductive to the grounding circuit; and a second conductive adhesive layer that attaches the second electromagnetic wave shielding layer to the second surface and makes it conductive to the grounding circuit; the flexible printed circuit board has a through-hole penetrating the substrate layer in the thickness direction, and a conductive material is disposed in the through-hole.
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