Semiconductor device, system, and method for forming the same

TW202638748APending Publication Date: 2026-09-16YANGTZE MEMORY TECH CO LTD
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Patent Information

Application Number
TW114130874
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-07
Filing Date
2025-08-13
Publication Date
2026-09-16

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    Figure TWG2TA001076234_003
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Abstract

A semiconductor device includes a peripheral circuit structure. The peripheral circuit structure includes a periphery circuit disposed on a substrate and a first interconnection structure disposed on the periphery circuit. The first interconnection structure includes a first conductive structure extending in a first direction, a second conductive structure extending in the first direction, and a third conductive structure extending in the first direction. The second conductive structure is disposed between the first conductive structure and the third conductive structure in a second direction perpendicular to the first direction. The first interconnection structure further includes a contact structure that extends in the second direction and is in direct contact with the first conductive structure and the third conductive structure.
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