Semiconductor device, system, and method for forming the same
TW202638748APending Publication Date: 2026-09-16YANGTZE MEMORY TECH CO LTD
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Patent Information
- Application Number
- TW114130874
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-07
- Filing Date
- 2025-08-13
- Publication Date
- 2026-09-16
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Abstract
A semiconductor device includes a peripheral circuit structure. The peripheral circuit structure includes a periphery circuit disposed on a substrate and a first interconnection structure disposed on the periphery circuit. The first interconnection structure includes a first conductive structure extending in a first direction, a second conductive structure extending in the first direction, and a third conductive structure extending in the first direction. The second conductive structure is disposed between the first conductive structure and the third conductive structure in a second direction perpendicular to the first direction. The first interconnection structure further includes a contact structure that extends in the second direction and is in direct contact with the first conductive structure and the third conductive structure.
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