IGBT devices with power clamping function and their manufacturing methods
TW202638753APending Publication Date: 2026-09-16重庆万国半导体科技有限公司
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Patent Information
- Application Number
- TW114131754
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-10
- Filing Date
- 2025-08-20
- Publication Date
- 2026-09-16
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Abstract
The present invention discloses an IGBT device with power clamping function and its manufacturing method. The IGBT device comprises a P region, an N-type buffer region, an N-drift region, a P-type body region, an N+region, a P+region, a front trench gate structure, a collector metal, and an emitter metal; The collector metal is connected to an SBR trench gate structure, which is used to suppress the reduction of resistance in the drift region when there is a large induced voltage surge. In the present invention, by adding an SBR trench gate structure connected to the collector metal on the IGBT device, the reduction in resistance of the drift region can be limited when subjected to large voltage surges, thereby avoiding a significant increase in current flowing through it and improving the service life of IGBT devices under such harsh operating conditions.
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