High reliability, low-cost interposer
TW202638796APending Publication Date: 2026-09-16AMERICAN CO ADIA SEMICON BONDING TECH CO LTD
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Patent Information
- Application Number
- TW115100076
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-01-03
- Filing Date
- 2026-01-02
- Publication Date
- 2026-09-16
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Abstract
An interposer assembly may include a substrate, a dielectric layer on a first surface of the substrate, and a first bridge die embedded in the dielectric layer. The substrate can include a plurality of first vias. The first bridge die can include a plurality of bridge die routing layers.
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