Horizontal photodiode and manufacturing method thereof

TW202638811APending Publication Date: 2026-09-16TAIWAN ASIA SEMICONDUCTOR CORPORATION
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Patent Information

Application Number
TW114108818
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Filing Date
2025-03-10
Publication Date
2026-09-16

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Abstract

A horizontal photodiode and a manufacturing method thereof are provided. The horizontal photodiode includes a mesa epitaxial layer, a second conductive type epitaxial layer, a transparent substrate and an optical bonding layer. The mesa epitaxial layer has a laser sintered side wall, which is arranged on the outer periphery of the mesa epitaxial layer. The second conductive type epitaxial layer is disposed under the mesa epitaxial layer. The optical bonding layer is interposed between the transparent substrate and the second conductive type epitaxial layer for blocking an external light from entering the second conductive type epitaxial layer through the transparent substrate.
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