LED packaging structure and light emitting components

Abstract

An LED packaging structure includes a conductive structure, an LED chip, and a packaging body. The LED chip is electrically connected to the conductive structure. Encapsulation body wraps conductive structure; The package has a top and bottom surface facing away from the LED chip, as well as an outer side surface connected between the top and bottom surfaces; The outer surface is in a stepped shape. The conductive structure has a connecting end that is exposed from the package. A light emitting component comprises the LED packaging structure.

Claims

1. An LED packaging structure, characterized in that it comprises: Conductive structure; LED chip, electrically connected to the conductive structure; And, a package that encapsulates the conductive structure; The package has a top surface and a bottom surface opposite to the LED chip, and an outer surface connected between the top surface and the bottom surface; the outer surface is stepped; wherein, the conductive structure has a terminal exposed outside the package; the LED package structure is a side-emitting LED; the outer surface of the package includes a mounting side, which is stepped; the mounting side includes a first surface area, a second surface area, and a stepped surface, the stepped surface connecting the first surface area and the second surface area; The second surface area is recessed relative to the first surface area so that when the first surface area is stacked on a circuit board, there is a gap between the second surface area and the circuit board; the power terminal is exposed from the second surface area.

2. The LED packaging structure as described in claim 1, wherein: The electrical terminal is located at the junction of the bottom surface of the package and the second surface area, and is exposed from the bottom surface of the package and the second surface area, respectively.

3. The LED packaging structure as described in claim 2, wherein: The power receiving terminal includes a first exposed surface exposed on the bottom surface of the package and a second exposed surface exposed on the second surface area; the power receiving terminal is provided with a cut through the first exposed surface and the second exposed surface.

4. The LED packaging structure as described in claim 3, wherein: The cut is in the shape of a quarter sphere, with the center of the sphere located on the intersection of the first exposed surface and the second exposed surface.

5. The LED packaging structure as described in claim 3, wherein: The conductive structure further includes a conductive plate; the LED chip is disposed on one side of the conductive plate and is conductively connected to the conductive plate; the power receiving end protrudes from one side of the conductive plate and extends toward the bottom surface of the package; the conductive structure further includes one or more exposed blocks; the exposed blocks protrude from the side of the conductive plate and are exposed on the outer side of the package.

6. The LED packaging structure as described in claim 1, wherein: The LED packaging structure is a front-emitting LED; the conductive structure further includes a conductive plate, the LED chip is disposed on one side of the conductive plate and is conductively connected to the conductive plate; the receiving end protrudes from the side of the conductive plate opposite to the LED chip and is exposed on the bottom surface of the package; and the receiving end is circumferentially recessed relative to the conductive plate, so that the conductive structure is stepped; the conductive structure further includes one or more exposed blocks; the exposed blocks protrude from the side of the conductive plate and are exposed on the outer side of the package; the outer side has a stepped surface facing the thickness direction of the LED packaging structure, and the exposed blocks are at least partially exposed on the stepped surface.

7. The LED packaging structure as described in any one of claims 1 to 6, wherein: The package includes a first part and a second part, the first part being located on one side of the second part along the thickness direction of the LED package structure; the conductive structure covers the first part, and the second part is laterally convex or concave relative to the first part, so that the outer surface of the package is stepped; the conductive structure has a support surface facing away from the bottom surface of the package; the second part has a receiving hole extending along the thickness direction to the support surface; the LED chip is supported on the support surface; and the receiving hole is filled with a sealing material.

8. A light-emitting component, characterized in that it comprises: Circuit board; And at least one LED packaging structure as described in any one of claims 1 to 7; The power-connecting terminals of the LED packaging structure are soldered to the circuit board, so that the LED chip is electrically connected to the circuit board.

9. The light-emitting component as described in claim 8, wherein: The light-emitting component also includes a light guide plate, the light-inlet surface of which corresponds to the light-outlet surface of the LED packaging structure.

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