Receiving substrate, laser-induced forward transfer method, and manufacturing method of electronic device
TW202638853APending Publication Date: 2026-09-16SHIN ETSU CHEMICAL CO LTD
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Patent Information
- Application Number
- TW115107429
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-03
- Filing Date
- 2026-03-02
- Publication Date
- 2026-09-16
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Abstract
This invention relates to a receiving substrate for transferring microstructures disposed on a supply substrate by laser. The receiving substrate has a resin layer on the surface for transferring the microstructures, and the raised height at the outer edge of the resin layer is less than 3 μm. This prevents tilting or displacement of the microstructures even at the outer edge of the receiving substrate when transferring them on the supply substrate by laser.
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