Processing methods, manufacturing methods of semiconductor devices, processing devices and programs

TW202638856APending Publication Date: 2026-09-16KOKUSAI DENKI KK
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Patent Information

Application Number
TW114147878
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-16
Filing Date
2025-12-08
Publication Date
2026-09-16

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Abstract

This invention provides a technique for efficiently etching the surface of a substrate. It comprises: (a) preparing a first processing container having a layer containing substance X formed therein; (b) transferring a substrate into the first processing container having the layer containing substance X formed therein; and (c) supplying a first processing agent to the substrate in the first processing container having the layer containing substance X formed therein, and reacting the first processing agent with substance X derived from the layer containing substance X to etch the surface of the substrate.
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