Thin sheet peeling device and thin sheet peeling method

TW202638869APending Publication Date: 2026-09-16TOKYO SEIMITSU CO LTD
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Patent Information

Application Number
TW115100961
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-13
Filing Date
2026-01-09
Publication Date
2026-09-16

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Abstract

The objective of this invention is to provide a sheet peeling apparatus that solves at least one of the problems of the prior art. The solution of this invention is a sheet peeling apparatus for peeling a protective sheet adhered to a semiconductor wafer. The protective sheet is held on a transport table by contacting a suction port connected to a depressurization channel with the wafer. The transport table and the suction port move relative to each other and separate, thereby peeling off the protective sheet.
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