Carrier device, semiconductor processing equipment, and control method thereof
TW202638870APending Publication Date: 2026-09-16BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
View PDF 0 Cites 0 Cited by
Patent Information
- Application Number
- TW115108558
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-11
- Filing Date
- 2026-03-09
- Publication Date
- 2026-09-16
Smart Images
Figure 00000000_0000_ABST
Abstract
This disclosure provides a carrier device and a semiconductor processing equipment. The carrier device includes a carrier body for supporting a frame wafer. The bearing surface of the carrier body is provided with multiple vent holes, and inside the carrier body there is a venting section that communicates with the multiple vent holes. The venting section is configured to connect with a vacuum extraction system. This disclosure is capable of resolving the issue of UV film blistering during the frame wafer descum process.
Need to check novelty before this filing date? Find Prior Art