Substrate rinsing system and method of rinsing semiconductor substrate using the same
TW202638875APending Publication Date: 2026-09-16APPLIED MATERIALS INC
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Patent Information
- Application Number
- TW114136972
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-02-28
- Filing Date
- 2025-09-25
- Publication Date
- 2026-09-16
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Figure TWG2TA001076277_001 
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Abstract
Exemplary substrate rinsing assemblies may include a rotor. The assemblies may include a plurality of substrate-grasping fingers disposed on the rotor. Each of the plurality of substrate-grasping fingers may be moveable between an open position and a closed position. An ultrasonic sensor may be disposed above the rotor at a position that is radially inward of the plurality of substrate-grasping fingers. The ultrasonic sensor may be configured to detect whether a position of a substrate received by the plurality of substrate-grasping fingers is within a predetermined operational range. The assemblies may include a plurality of reflective sensors. Each of the plurality of reflective sensors may be aligned with a respective one of the plurality of substrate grasping fingers. Each of the plurality of reflective sensors may be configured to detect whether the respective one of the plurality of substrate-grasping fingers is in the open position or the closed position.
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