Substrate rinsing system and method of rinsing semiconductor substrate using the same

TW202638875APending Publication Date: 2026-09-16APPLIED MATERIALS INC
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Patent Information

Application Number
TW114136972
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-28
Filing Date
2025-09-25
Publication Date
2026-09-16

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    Figure TWG2TA001076277_002
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    Figure TWG2TA001076277_003
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Abstract

Exemplary substrate rinsing assemblies may include a rotor. The assemblies may include a plurality of substrate-grasping fingers disposed on the rotor. Each of the plurality of substrate-grasping fingers may be moveable between an open position and a closed position. An ultrasonic sensor may be disposed above the rotor at a position that is radially inward of the plurality of substrate-grasping fingers. The ultrasonic sensor may be configured to detect whether a position of a substrate received by the plurality of substrate-grasping fingers is within a predetermined operational range. The assemblies may include a plurality of reflective sensors. Each of the plurality of reflective sensors may be aligned with a respective one of the plurality of substrate grasping fingers. Each of the plurality of reflective sensors may be configured to detect whether the respective one of the plurality of substrate-grasping fingers is in the open position or the closed position.
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