Thermal processing apparatus
TW202638883APending Publication Date: 2026-09-16PROASIA SEMICONDUCTOR CORP
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Patent Information
- Application Number
- TW114107961
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2025-03-04
- Publication Date
- 2026-09-16
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Figure TWG2TA001075544_001 
Figure TWG2TA001075544_002 
Figure TWG2TA001075544_003
Abstract
The present invention relates to a thermal processing apparatus, comprising a processing chamber, a rotating susceptor, a plurality of airflow-driving elements, a support element, and a heat source. The processing chamber has an inlet and an outlet. The rotating susceptor is disposed within the processing chamber and includes a bearing that allows the rotating susceptor to rotate relative to the processing chamber. The plurality of airflow-driving elements are spaced apart and arranged around an outer surface of the rotating susceptor. The support element is disposed on the rotating susceptor and is configured to carry a substrate. The heat source is arranged on a surface of the processing chamber to provide radiant heat energy to the substrate on the support element. When an airflow enters the processing chamber through the inlet, it drives the airflow-driving elements, causing the rotating susceptor to rotate along with the support element, and is subsequently discharged through the outlet.
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