Substrate processing method and substrate processing apparatus

Abstract

[Problem] This disclosure aims to describe a substrate processing method and apparatus capable of suppressing arc discharge during substrate processing. [Solution] The substrate processing method includes: a holding process for holding the outer periphery of a substrate by means of a conductive holding portion; and a liquid supply process for supplying a liquid to the substrate via a supply pipe having a conductive member on the outer periphery after the holding process. The conductive member is electrically connected to one end of a variable resistor portion with a variable resistance value. The holding portion is electrically connected to the other end of the variable resistor portion. The liquid supply process includes: a first sub-process for supplying a liquid to the substrate via the supply pipe while the resistance value of the variable resistor portion is set to a first value; and a second sub-process for changing the resistance value of the variable resistor portion to a second value lower than the first value while continuously supplying a liquid from the first sub-process, and supplying a liquid to the substrate via the supply pipe.

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