Semiconductor processing apparatus

TW202638892APending Publication Date: 2026-09-16BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information

Application Number
TW115105829
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-02-28
Filing Date
2026-02-12
Publication Date
2026-09-16

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Abstract

This application discloses a semiconductor processing apparatus, which belongs to the technical field of semiconductor processing. A support is installed within a processing chamber, the bottom wall of the support is provided with multiple through holes, and an ion membrane is attached to the bottom wall of the support, thereby dividing the processing chamber into a first chamber and a second chamber. The side wall of the support is provided with multiple liquid inlet holes, which are distributed circumferentially at intervals along the support and communicate with the second chamber. A flow equalizing component is disposed within the second chamber, wherein the flow equalizing component comprises multiple guide tubes distributed circumferentially along the support, each of which is oriented toward the center of the support. The multiple guide tubes are all fixedly connected to the support, and one end of each guide tube is in one-to-one communication with the multiple liquid inlet holes. Each guide tube is provided with multiple liquid discharge holes, which are regularly distributed along the extension direction of the guide tube and oriented in the same direction, so as to ensure uniform distribution of ions within the second chamber.
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