Substrate processing system and conveying method

Abstract

The plasma processing apparatus of the present invention includes a control unit. The control unit is configured to execute (a), (b), (c), (d), and (e). (a) is the step of conveying the ring member to the conveying position. (b) is the step of lifting the ring member by a plurality of lifting pins, causing the ring member to self-guide, such that the front ends of the plurality of lifting pins are respectively located in a plurality of recesses of the ring member. (c) is the step of lowering the ring member onto the end effector. (d) is the step of obtaining a first correction value by detecting the horizontal position of the ring member by a first detector after (c). (e) is the step of obtaining a second correction value by detecting the rotational position of the ring member by a second detector after (c).

Images