Carrier device, semiconductor processing equipment, and method for fabricating carrier device

Abstract

This application discloses a carrier device, semiconductor processing equipment, and a preparation method for the carrier device, belonging to the technical field of semiconductor processing. The disclosed carrier device comprises, in sequentially stacked arrangement, a carrier member, an adhesive layer, a transition layer, and a cooling member. The carrier member is used for carrying a wafer, and the carrier member and the cooling member are bonded via the adhesive layer and the transition layer. The portion of the carrier member in contact with the adhesive layer is made of a ceramic material, and the portion of the cooling member in contact with the transition layer is made of a metal material. The coefficient of thermal expansion of the transition layer is of the same order of magnitude as that of the metal material, and the softening temperature of the transition layer is lower than that of the adhesive layer. The above solution can solve the problem in the related art where the carrier device is prone to affecting the processing effect on the wafer.

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