System and method to optimize final tests with a three-stage machine learning approach using wafer test data

Abstract

The disclosure describes semiconductors test systems and related methods for performing semiconductor die final testing. Semiconductor dies may be tested in at least two stages: wafer tests and final die tests. The systems and methods of the disclosure reduce the amount of final die tests that are performed on semiconductor dies, using data from the wafer tests. A semiconductor test system may include a test probe to collect wafer test data from wafers each having a plurality of dies. The dimensionality of the wafer test data may be reduced, and the dies may may be clustered into die clusters using the dimensionally reduced data. Each die cluster may be clustered based on a likelihood that the cluster includes a failed die. The die clusters may be refined into smaller die clusters. Optionally, the smaller die clusters may be used to select at least some dies for final die testing.

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