Bond tool, system, bond head, die bonder, and method to use thereof

TW202638928APending Publication Date: 2026-09-16BESI SWITZERLAND AG
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Patent Information

Application Number
TW115103387
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-01-28
Filing Date
2026-01-28
Publication Date
2026-09-16

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Abstract

Bond tool for bonding a die to a target with a bond head comprising such a tool, a die bonder and a system for shaping a target for a bond operation, in which a die is bonded to the target with such a tool and the corresponding method.
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