Fluid discharge device and semiconductor process equipment
TW202638929APending Publication Date: 2026-09-16BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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Patent Information
- Application Number
- TW115105425
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-04
- Filing Date
- 2026-02-11
- Publication Date
- 2026-09-16
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Abstract
A fluid discharge device and semiconductor process equipment are disclosed. The fluid discharge device includes a housing, a first partition, and a second partition. The housing has a first fluid inlet, a drain outlet, and an exhaust outlet. The first fluid inlet is connected to the fluid discharge outlet of a semiconductor process chamber. The first partition is located at the bottom of the housing and divides it into a main body area and a liquid storage area. The upper edge of the first partition is spaced apart from the top wall of the housing. The first fluid inlet communicates with the liquid storage area. Both the drain outlet and the exhaust outlet communicate with the main body area. The second partition is attached to the inner wall of the housing, with at least a portion extending into the liquid storage area. The lower edge of the second partition is spaced apart from the bottom wall of the housing. Vertically, the upper edge of the first partition is positioned higher than the lower edge of the second partition.
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