Substrate processing apparatus and maintenance method

Abstract

In a substrate processing apparatus and a maintenance method for the substrate processing apparatus, a correction mechanism is provided within the internal space of the chamber body. This improves the efficiency of maintenance operations by facilitating access to the internal space. The correction mechanism is used to raise and lower at least one of the correction support and the substrate support in a correction posture where a correction member protrudes downward from a correction support portion located between a cover portion used to open and close the opening of the chamber body and a substrate support portion. This causes the correction member to abut against the upper surface of the substrate supported by the substrate support portion and correct the warping of the substrate. The correction support portion is configured to swing freely about a first swing axis extending in a first horizontal direction, and can switch between a separation posture (where the correction member moves upward from the substrate support portion) and a correction posture when the opening is opened by the cover portion.

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