Heat treatment equipment

Abstract

A technique for reducing the floor space of a heat treatment apparatus is provided. The heat treatment apparatus includes: a processing container capable of housing multiple substrates; a heating unit disposed around the processing container and heating the multiple substrates housed within the processing container; and a cooling unit supplying cooling gas to the space between the processing container and the heating unit for cooling. The cooling unit includes: piping allowing the cooling gas to flow; a heat exchanger disposed on the piping and exchanging heat with the cooling gas; and multiple blowers disposed on the piping, supplying the cooling gas to the heating unit through the piping. In the cooling unit, the heat exchanger and the multiple blowers are positioned adjacent to the heating unit.

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