Semiconductor devices and manufacturing methods thereof

TW202638958APending Publication Date: 2026-09-16KIOXIA CORP
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Patent Information

Application Number
TW114128825
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-13
Filing Date
2025-07-30
Publication Date
2026-09-16

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Abstract

This invention improves transmission speed without compromising the reliability of memory chips. The semiconductor device includes: a logic chip configured with logic circuitry; and a plurality of memory chips stacked on the upward-facing logic chip, each of the plurality of memory chips having a channel comprising an oxide semiconductor layer.
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