Semiconductor packages and methods of forming

Abstract

A semiconductor package includes a substrate and a semiconductor structure attached to the substrate, where the semiconductor structure includes: an interposer; a die attached to a first side of the interposer distal from the substrate; a first encapsulant material on the first side of the interposer around the die; and conductive bumps at a second side of the interposer facing the substrate. The semiconductor package further includes: a second encapsulant material on the substrate around the semiconductor structure, where there is a cavity in the second encapsulant material over the semiconductor structure, wherein a first side of the semiconductor structure distal from the substrate is exposed at a bottom of the cavity; a thermal interface material (TIM) in the cavity and attached to the first side of the semiconductor structure; and a heat spreader over and attached to the TIM.

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