Methods for cooling of a heat-generating device, semiconductor package and methods of fabrication

TW202638964APending Publication Date: 2026-09-16TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW114117037
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-07
Filing Date
2025-05-06
Publication Date
2026-09-16

Smart Images

  • Figure TWG2TA001076104_001
    Figure TWG2TA001076104_001
  • Figure TWG2TA001076104_002
    Figure TWG2TA001076104_002
  • Figure TWG2TA001076104_003
    Figure TWG2TA001076104_003
Patent Text Reader

Abstract

Packages are formed from a heat-generating device and a plurality of MEMS cooling devices attached thereto. Such packages can be cooled using dielectric liquids. Each MEMS cooling device includes an actuator bonded to a carrier wafer. The carrier wafer includes a plurality of holes extending through a substrate. The actuators vibrate and increases the rate of liquid flow past the heat-generating device, improving the cooling effect. Some cooling devices vibrate in one direction, and some cooling devices vibrate in the opposite direction, to further enhance liquid flow.
Need to check novelty before this filing date? Find Prior Art