Manufacturing method of multilayer wiring board

Abstract

This invention discloses a method for manufacturing a multilayer wiring substrate, comprising: a substrate preparation step of preparing a wiring substrate having an organic insulating film and a metal film on the organic insulating film; an opening formation step of forming an opening in the metal film; and an organic insulating film removal step of removing the organic insulating film from the opening using the metal film with the opening as a mask. In this method, the thickness of the metal film is set to 100 nm or less. Therefore, due to the thinness of the metal film, peeling caused by thermal expansion can be suppressed. Furthermore, roughening the substrate of the metal film becomes unnecessary, or the roughening step time can be shortened. Moreover, due to the thinness of the metal film, the opening can be easily formed in the metal film. As a result, a method for manufacturing a multilayer wiring substrate capable of producing multilayer wiring substrates with high productivity and low cost can be provided.

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