Semiconductor chip, semiconductor decive, and method of manufacturing semiconductor device

Abstract

A semiconductor chip is provided. The semiconductor chip includes a semiconductor unit, a post, a first electrode and a second electrode. The semiconductor unit includes a semiconductor die and a filling layer, wherein the filling layer surrounds the semiconductor die, and the semiconductor die includes a first type semiconductor layer and a second type semiconductor layer. The post is disposed on a first side of the semiconductor unit. The first electrode is electrically connected to the first type semiconductor layer. The second electrode is electrically connected to the second type semiconductor layer. Wherein, the first electrode and the second electrode are disposed on a second side of the semiconductor unit, and center of gravity of the semiconductor chip is closer to the second side than the first side.

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