Lead frame and its manufacturing method

TW202638977APending Publication Date: 2026-09-16SHINKO ELECTRIC IND CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
TW115108891
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2025-03-14
Filing Date
2026-03-11
Publication Date
2026-09-16

Smart Images

  • Figure TWG2TA001077343_001
    Figure TWG2TA001077343_001
  • Figure TWG2TA001077343_002
    Figure TWG2TA001077343_002
  • Figure TWG2TA001077343_003
    Figure TWG2TA001077343_003
Patent Text Reader

Abstract

A lead frame with a shape that facilitates the subdivision of resist during removal in manufacturing is provided. The lead frame includes: a plurality of product areas arranged separately from each other in a first direction; and a frame portion supporting each of the product areas from a peripheral side. The frame portion includes: a first region, located on one side of each of the product areas in a top view and extending in the first direction; a second region, located opposite the first region across each of the product areas in a top view; a first groove provided in the first region and the second region and opening on the upper surface of the frame portion; and a second groove provided in the first region and the second region and opening on the lower surface of the frame portion. The first groove and the second groove are positioned in a position that does not overlap in a top view.
Need to check novelty before this filing date? Find Prior Art