Passing signals through micro device sidewalls

TW202638978APending Publication Date: 2026-09-16VUEREAL INC
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Patent Information

Application Number
TW114146439
Authority / Receiving Office
TW · TW
Patent Type
Applications
Current Assignee / Owner
Priority Date
2020-05-11
Filing Date
2021-05-11
Publication Date
2026-09-16

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Abstract

The present invention relates to structure and formation of side walls in micro devices. The structure allows access of one side of the micro device to another side through conductive layers and pads. In particular, the top and bottom sides of the micro devices are in direction of the current in the device and sidewalls are isolation surfaces surrounding the top and bottom sides of the device.
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