Package substrate and manufacturing method thereof

Abstract

The disclosure provides a package substrate and a manufacturing method thereof, the package substrate comprises: a carrier having a first side and a second side opposite to the first side; a first dielectric layer formed on the first side of the carrier; a second dielectric layer formed on the second side of the carrier; a plurality of first circuit layer formed on and within the first dielectric layer; and a plurality of second circuit layer formed on and within the second dielectric layer; wherein a copper volume of the first circuit layer on the first dielectric layer is equal to or greater than a copper volume of the second circuit layer on the second dielectric layer.

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