Package substrate and fabricating method thereof
TW202638984APending Publication Date: 2026-09-16AALTOSEMI INC
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Patent Information
- Application Number
- TW114113017
- Authority / Receiving Office
- TW · TW
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-03-07
- Filing Date
- 2025-04-07
- Publication Date
- 2026-09-16
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Figure 00000000_0000_ABST
Abstract
A packaging substrate is made by forming a circuit structure on one side of a core body with a core layer, so the other side of the core body is used as a ball side to reduce the number of layers of the packaging substrate. Therefore, the total thickness of the packaging substrate is advantageous for thinning.
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